XCVC1802-1LSEVSVD1760

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Mfr.Part #
XCVC1802-1LSEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1210 (3225 Metric)
Datasheet
Download
Description
IC VERSAL AICORE FPGA 1760BGA
Stock
37,008
In Stock :
37,008

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
RAM Size :
256KB
Size / Dimension :
0.126 L x 0.102 W (3.20mm x 2.60mm)
Power (Watts) :
1W
Features :
Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed :
400MHz, 1GHz
Number of Terminations :
2
Package / Case :
1210 (3225 Metric)
Supplier Device Package :
1210
Primary Attributes :
Versal™ AI Core FPGA, 1.5M Logic Cells
Height - Seated (Max) :
0.028 (0.70mm)
Number of I/O :
692
Failure Rate :
-
Temperature Coefficient :
±200ppm/°C
Flash Size :
-
Composition :
Thick Film
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Tolerance :
±2%
Package :
Tape and Reel (TR)
Architecture :
MPU, FPGA
Resistance :
12 kOhms
Product Status :
Active
Peripherals :
DDR, DMA, PCIe
Operating Temperature :
-55°C ~ 155°C
Ratings :
-
Series :
SG73S-RT
Introducing System On Chip (SoC) AMD Xilinx XCVC1802-1LSEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Package / Case:1210 (3225 Metric), Operating Temperature:-55°C ~ 155°C, XCVC1802-1LSEVSVD1760 pinout, XCVC1802-1LSEVSVD1760 datasheet PDF, XCVC1802-1LSEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1802-1LSEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVC1802-1LSEVSVD1760


2 Terminations -55°C ~ 155°C System On Chip SG73S-RT Series 692 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1210 (3225 Metric).With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.SG73S-RT is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -55°C ~ 155°C.This SoC security combines Versal™ AI Core FPGA, 1.5M Logic Cells, an important feature to keep in mind.692 I/Os are available in this SoC part.In total, there are 2 terminations, so system on a chip is really aided by this.The flash size of the SoC meaning is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVC1802-1LSEVSVD1760 System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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