XCVC1702-2LLENSVG1369

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Mfr.Part #
XCVC1702-2LLENSVG1369
Manufacturer
AMD Xilinx
Package / Case
1369-BFBGA
Datasheet
Download
Description
IC VERSAL AI-CORE FPGA 1369BGA
Stock
27,655
In Stock :
27,655

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Product Status :
Active
Speed :
450MHz, 1.08GHz
Series :
Versal™ AI Core
Architecture :
MPU, FPGA
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size :
-
Supplier Device Package :
1369-BGA (35x35)
Peripherals :
DDR, DMA, PCIe
Package / Case :
1369-BFBGA
Primary Attributes :
Versal™ AI Core FPGA, 1M Logic Cells
Package :
Tray
Number of I/O :
500
Operating Temperature :
0°C ~ 100°C (TJ)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM Size :
-
Introducing System On Chip (SoC) AMD Xilinx XCVC1702-2LLENSVG1369 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1369-BFBGA, Operating Temperature:0°C ~ 100°C (TJ), XCVC1702-2LLENSVG1369 pinout, XCVC1702-2LLENSVG1369 datasheet PDF, XCVC1702-2LLENSVG1369 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1702-2LLENSVG1369 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C ~ 100°C (TJ) System On Chip Versal™ AI Core Series 500 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.There is a 1369-BFBGA package assigned to this system on a chip by the manufacturer.With - RAM implemented, this SoC chip provides reliable operation.A MPU, FPGA technique is used for the SoC design's internal architecture.Versal™ AI Core is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C ~ 100°C (TJ) when it is operating normally.A significant feature of this SoC security is the combination of Versal™ AI Core FPGA, 1M Logic Cells.As a whole, this SoC part is comprised of 500 inputs and outputs.This flash has a size of -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of AMD


XCVC1702-2LLENSVG1369 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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