XCV1600E-7FG900C
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- Mfr.Part #
- XCV1600E-7FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 700 I/O 900FBGA
- Stock
- 1,502
- In Stock ：
- 1,502
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 7776
- Lead Free :
- Contains Lead
- Supply Voltage :
- 1.8V
- Mount :
- Surface Mount
- Number of Equivalent Gates :
- 419904
- Width :
- 31mm
- Height Seated (Max) :
- 2.6mm
- Published :
- 2004
- Number of Gates :
- 2188742
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Speed Grade :
- 7
- Package / Case :
- 900-BBGA
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 589824
- Pbfree Code :
- No
- RAM Size :
- 72kB
- Operating Temperature :
- 0°C~85°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Pin Count :
- 900
- Series :
- Virtex®-E
- Number of Pins :
- 900
- Length :
- 31mm
- Radiation Hardening :
- No
- Number of Outputs :
- 700
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- ECCN Code :
- 3A991.D
- Clock Frequency :
- 400MHz
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 700
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 1.71V~1.89V
- Number of Logic Elements/Cells :
- 34992
- Base Part Number :
- XCV1600E
- Number of Terminations :
- 900
- Operating Supply Voltage :
- 1.8V
- Datasheets
- XCV1600E-7FG900C
FPGAs AMD Xilinx XCV1600E-7FG900C Overview
The AMD Xilinx XCV1600E-7FG900C FPGA stands out as a high-performance, field-programmable gate array that provides an advanced solution for developing complex digital circuits in a programmable environment. This FPGA is designed to support applications requiring high I/O bandwidth and intensive logic operations. With its 900FBGA packaging, the XCV1600E-7FG900C ensures a compact form factor while offering robust interfacing capabilities. The product’s versatility makes it an ideal choice for designers looking to leverage high-speed signal processing and data manipulation in real-time applications.
XCV1600E-7FG900C Features
The XCV1600E-7FG900C by AMD Xilinx is equipped with 700 user I/Os, allowing for extensive connectivity and interfacing with a wide range of peripheral devices. The FPGA’s high I/O count is beneficial for applications that require multiple simultaneous connections, such as complex digital processing systems. Additionally, the FPGA utilizes a 900FBGA package that not only provides a high degree of integration but also enhances thermal performance and reduces overall footprint on system boards.
XCV1600E-7FG900C Applications
- Telecommunications: Used in networking equipment for processing high-speed data transfers and signal processing. The FPGA's capacity for handling multiple data streams simultaneously makes it ideal for routers, switches, and base station development.
- Data Centers: Integral for managing data flow and storage operations, enhancing the efficiency of server farms and storage arrays through accelerated data processing capabilities.
- Aerospace and Defense: Utilized in radar and satellite systems for real-time data acquisition and processing, offering reliability under extreme conditions and supporting mission-critical applications.
- Medical Imaging: Helps in the development of medical imaging devices such as MRI and ultrasound machines, where high-speed image processing is crucial for generating accurate diagnostic results.
- Automotive: Plays a critical role in advanced driver-assistance systems (ADAS) by enabling rapid processing of input from multiple sensors, aiding in real-time decision making for safety and navigation.
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