XCV1600E-6FG900I

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Mfr.Part #
XCV1600E-6FG900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 700 I/O 900FBGA
Stock
8,588
In Stock :
8,588

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-609 Code :
e0
Series :
Virtex®-E
Number of Logic Elements/Cells :
34992
Pbfree Code :
No
Width :
31mm
Supply Voltage :
1.8V
Radiation Hardening :
No
Voltage - Supply :
1.71V~1.89V
Packaging :
Tray
Number of Outputs :
700
Number of Pins :
900
Number of Equivalent Gates :
419904
Terminal Pitch :
1mm
Number of Gates :
2188742
Number of LABs/CLBs :
7776
Package / Case :
900-BBGA
Peak Reflow Temperature (Cel) :
225
Operating Supply Voltage :
1.8V
Terminal Form :
Ball
Combinatorial Delay of a CLB-Max :
0.47 ns
Mount :
Surface Mount
Number of Terminations :
900
RoHS Status :
Non-RoHS Compliant
Base Part Number :
XCV1600E
Pin Count :
900
Mounting Type :
Surface Mount
Clock Frequency :
357MHz
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
ECCN Code :
3A991.D
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
6
Total RAM Bits :
589824
RAM Size :
72kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
31mm
Number of I/O :
700
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~100°C TJ
Lead Free :
Contains Lead
Published :
2004
Datasheets
XCV1600E-6FG900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1600E-6FG900I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:900, Package / Case:900-BBGA, Number of Terminations:900, Base Part Number:XCV1600E, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, XCV1600E-6FG900I pinout, XCV1600E-6FG900I datasheet PDF, XCV1600E-6FG900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1600E-6FG900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV1600E-6FG900I


FPGAs AMD Xilinx XCV1600E-6FG900I Overview

Introducing the AMD Xilinx XCV1600E-6FG900I, a state-of-the-art FPGA (Field Programmable Gate Array) designed for high-performance applications requiring a robust and flexible hardware platform. As part of AMD Xilinx's renowned FPGA product line, this component offers a powerful solution capable of supporting complex digital systems. The XCV1600E-6FG900I is built to provide maximum efficiency and scalability, making it an ideal choice for developers and engineers looking to push the boundaries of technology in various industries.

XCV1600E-6FG900I Features

The AMD Xilinx XCV1600E-6FG900I FPGA stands out with its impressive configuration options and technical specifications. It supports a wide array of I/O options with 700 I/O pins, allowing for extensive peripheral and interface integrations. The unit is packaged in a compact 900FBGA, ensuring that it can fit into tight spaces while maintaining high levels of performance and reliability. The device operates efficiently under a range of environmental conditions, highlighted by its industrial-grade temperature specification.

XCV1600E-6FG900I Applications

  • Telecommunications: Deployed in communication infrastructure to manage signal processing and data flow, enhancing network reliability and speed.
  • Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to process real-time sensory data and support decision-making processes.
  • Industrial Automation: Integral in controlling and monitoring machinery in manufacturing lines, improving operational efficiency and safety.
  • Consumer Electronics: Embedded in devices such as high-definition televisions and gaming consoles to manage video processing and enhance user experience.
  • Medical Equipment: Used in diagnostic and monitoring systems to handle complex computations and data analysis, ensuring accuracy and reliability in medical applications.
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