XCV1600E-6FG900C
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- Mfr.Part #
- XCV1600E-6FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 700 I/O 900FBGA
- Stock
- 7,901
- In Stock ：
- 7,901
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1.8V
- Mounting Type :
- Surface Mount
- Base Part Number :
- XCV1600E
- Pbfree Code :
- No
- Radiation Hardening :
- No
- Operating Supply Voltage :
- 1.8V
- ECCN Code :
- 3A991.D
- Number of Pins :
- 900
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 7776
- Speed Grade :
- 6
- RAM Size :
- 72kB
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 589824
- JESD-609 Code :
- e0
- Voltage - Supply :
- 1.71V~1.89V
- Package / Case :
- 900-BBGA
- Clock Frequency :
- 357MHz
- Series :
- Virtex®-E
- Published :
- 2004
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 31mm
- Terminal Form :
- Ball
- Number of I/O :
- 700
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 900
- Mount :
- Surface Mount
- Number of Outputs :
- 700
- Lead Free :
- Contains Lead
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 34992
- Pin Count :
- 900
- Operating Temperature :
- 0°C~85°C TJ
- Number of Gates :
- 2188742
- Length :
- 31mm
- Number of Equivalent Gates :
- 419904
- Datasheets
- XCV1600E-6FG900C
FPGAs AMD Xilinx XCV1600E-6FG900C Overview
The FPGAs AMD Xilinx XCV1600E-6FG900C is a high-performance, field-programmable gate array that is well-suited for a range of demanding applications. This device integrates advanced features and technology from AMD Xilinx, offering a robust solution for designers looking to leverage speed and flexibility. With its large number of I/O options and substantial logic capacity, the XCV1600E-6FG900C serves as an essential component for systems requiring complex, multi-functional tasks in real-time environments.
XCV1600E-6FG900C Features
The XCV1600E-6FG900C FPGA features 700 user I/O pins, making it highly adaptable for various interfacing requirements. Housed in a 900FBGA package, it ensures a compact footprint while allowing for efficient thermal management. The device operates at a frequency of 6FG, providing the necessary speed for high-throughput applications. Its architecture is designed to support rapid prototyping and scalable solutions, essential for both development phases and final production runs.
XCV1600E-6FG900C Applications
- Telecommunications: Utilized in communication infrastructure, the XCV1600E-6FG900C supports high-speed signal processing which is essential for base stations and network switches.
- Data Centers: Facilitates accelerated data processing and storage solutions, enhancing server capabilities and cloud computing operations.
- Aerospace and Defense: Deployed in avionics and military hardware, providing robust computation and reliable performance under extreme conditions.
- Automotive: Integral to advanced driver-assistance systems (ADAS), it contributes to the processing required for real-time decision making and vehicle automation.
- Industrial Automation: Used in complex machinery and production lines, it helps in optimizing control systems and operational efficiency.
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