XCV1600E-6FG860I
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- Mfr.Part #
- XCV1600E-6FG860I
- Manufacturer
- AMD Xilinx
- Package / Case
- 860-BGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 860FBGA
- Stock
- 12,490
- In Stock ：
- 12,490
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 7776
- Base Part Number :
- XCV1600E
- Lead Free :
- Contains Lead
- Supply Voltage :
- 1.8V
- Power Supplies :
- 1.2/3.61.8V
- Packaging :
- Tray
- Length :
- 42.5mm
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Clock Frequency :
- 357MHz
- ECCN Code :
- 3A001.A.7.A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 42.5mm
- JESD-609 Code :
- e0
- Published :
- 2004
- RoHS Status :
- Non-RoHS Compliant
- Terminal Pitch :
- 1mm
- RAM Size :
- 72kB
- Number of Gates :
- 2188742
- Number of Logic Elements/Cells :
- 34992
- JESD-30 Code :
- S-PBGA-B860
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- 225
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 660
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 660
- Height Seated (Max) :
- 2.2mm
- Number of Inputs :
- 660
- Operating Temperature :
- -40°C~100°C TJ
- Mount :
- Surface Mount
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.71V~1.89V
- Terminal Position :
- BOTTOM
- Number of Terminations :
- 860
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Total RAM Bits :
- 589824
- Reach Compliance Code :
- not_compliant
- Number of Equivalent Gates :
- 419904
- Package / Case :
- 860-BGA
- Series :
- Virtex®-E
- Pin Count :
- 860
- Datasheets
- XCV1600E-6FG860I
2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860
XCV1600E-6FG860I Overview
Fpga chips is supplied in the 860-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 660 I/Os for transferring data in a more coherent manner. There are 34992 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 660 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 860 terminations. The RAM bits that this device offer is 589824. Its base part number XCV1600E can be used to find related parts. The RAM si72kBe of this FPGA module reaches 72kB to ensure normal operation of the program. This FPGA is built as an array of 7776 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.61.8V power supply. Its basic building block contains 2188742 gates. Fpga semiconductor is equipped wfpga semiconductorh 860 pin count. Typically, fpga semiconductor uses a crystal oscillating at 357MHz . 419904 equivalent gates are used for the design implement in the FPGA.
XCV1600E-6FG860I Features
660 I/Os
Up to 589824 RAM bits
XCV1600E-6FG860I Applications
There are a lot of Xilinx Inc.
XCV1600E-6FG860I FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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