XCV1600E-6FG860C

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Mfr.Part #
XCV1600E-6FG860C
Manufacturer
AMD Xilinx
Package / Case
860-BGA
Datasheet
Download
Description
IC FPGA 660 I/O 860FBGA
Stock
42,604
In Stock :
42,604

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
7776
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Qualification Status :
Not Qualified
ECCN Code :
3A001.A.7.A
Peak Reflow Temperature (Cel) :
225
Clock Frequency :
357MHz
Number of Logic Elements/Cells :
34992
Mounting Type :
Surface Mount
Package / Case :
860-BGA
Width :
42.5mm
Number of Outputs :
660
Mount :
Surface Mount
Height Seated (Max) :
2.2mm
Voltage - Supply :
1.71V~1.89V
Total RAM Bits :
589824
Supply Voltage :
1.8V
Number of Gates :
2188742
Length :
42.5mm
Number of I/O :
660
JESD-609 Code :
e0
Packaging :
Tray
RoHS Status :
Non-RoHS Compliant
Number of Inputs :
660
Number of Equivalent Gates :
419904
Published :
2004
Pin Count :
860
Power Supplies :
1.2/3.61.8V
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
0.47 ns
Reach Compliance Code :
not_compliant
JESD-30 Code :
S-PBGA-B860
Number of Terminations :
860
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Operating Temperature :
0°C~85°C TJ
Terminal Finish :
Tin/Lead (Sn63Pb37)
Lead Free :
Contains Lead
Series :
Virtex®-E
RAM Size :
72kB
Base Part Number :
XCV1600E
Datasheets
XCV1600E-6FG860C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1600E-6FG860C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:860-BGA, Number of Terminations:860, Operating Temperature:0°C~85°C TJ, Base Part Number:XCV1600E, XCV1600E-6FG860C pinout, XCV1600E-6FG860C datasheet PDF, XCV1600E-6FG860C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1600E-6FG860C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860

XCV1600E-6FG860C Overview


A 860-BGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 660 I/Os help it transfer data more efficiently. A fundamental building block contains 34992 logic elements or cells. Power is provided by a 1.8V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. FPGAs belonging to the Virtex®-E series are a type of FPGA that belong to the Virtex®-E series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 660 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 860 terminations on fpga chips. Having a RAM bit size of 589824 means that this device will offer you a lot of memory. For related parts, use its base part number XCV1600E. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. 7776 LABs/CLBs are integrated into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Power is supplied to the device by a 1.2/3.61.8V battery. 2188742 gates make up the basic block of its construction. Featuring 860 pins in total, it is a versatile device. Most commonly, this device makes use of an oscillating crystal frequency of 357MHz to operate. There are 419904 equivalent gates in the FPGA that implement the design.

XCV1600E-6FG860C Features


660 I/Os
Up to 589824 RAM bits


XCV1600E-6FG860C Applications


There are a lot of Xilinx Inc.
XCV1600E-6FG860C FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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