XCV150-6FG256C
- Mfr.Part #
- XCV150-6FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 27,065
- In Stock :
- 27,065
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 2.5V
- Number of Inputs :
- 176
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 3888
- Number of Outputs :
- 176
- Pbfree Code :
- No
- Reach Compliance Code :
- not_compliant
- Packaging :
- Tray
- Lead Free :
- Contains Lead
- Clock Frequency :
- 333MHz
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 256
- RAM Size :
- 6kB
- Number of CLBs :
- 864
- Power Supplies :
- 1.2/3.62.5V
- Number of LABs/CLBs :
- 864
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 2.375V~2.625V
- Peak Reflow Temperature (Cel) :
- 225
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Package / Case :
- 256-BGA
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of I/O :
- 176
- Width :
- 17mm
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 49152
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Ball
- Number of Gates :
- 164674
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Base Part Number :
- XCV150
- Mount :
- Surface Mount
- Published :
- 2002
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pin Count :
- 256
- Length :
- 17mm
- JESD-30 Code :
- S-PBGA-B256
- Series :
- Virtex®
- Height Seated (Max) :
- 2mm
- Datasheets
- XCV150-6FG256C

FPGAs AMD Xilinx XCV150-6FG256C Overview
The AMD Xilinx XCV150-6FG256C is a high-performance FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital signal and image processing applications. This FPGA is ideal for developers looking for a versatile, high-speed programmable solution that can handle a wide range of applications, from advanced computing systems to sophisticated industrial designs. With its 256-pin FBGA (Fine-pitch Ball Grid Array) packaging, the XCV150-6FG256C ensures a compact footprint while offering robust I/O capabilities with 176 programmable input/output pins. This product stands out in the FPGAs category for its reliable performance and the trusted quality of AMD Xilinx, making it a prime choice for bulk purchases by B2B customers seeking efficient and scalable solutions.
XCV150-6FG256C Features
The XCV150-6FG256C FPGA from AMD Xilinx features a robust array of capabilities designed to support complex digital processing needs. Key features include:
- 176 I/O pins, providing ample connectivity for multiple peripherals and interfaces.
- 256-pin FBGA packaging, which offers a reduced footprint for space-sensitive applications while maintaining high performance and reliability.
- High configurability and flexibility, allowing for tailored applications and updates post-deployment.
- Scalable architecture, making it suitable for both single-product solutions and large-scale integrations.
XCV150-6FG256C Applications
- Telecommunications Equipment: Utilizes its high I/O count and fast processing capabilities to manage signal integrity and data flow in complex networks.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) with its ability to process multiple real-time inputs and outputs efficiently.
- Consumer Electronics: Ideal for high-definition video processing and complex user interface designs in devices such as smart TVs and gaming consoles.
- Industrial Automation: Enhances control systems by providing the speed and flexibility needed for real-time decision-making and system monitoring.
- Medical Devices: Facilitates the development of medical imaging systems, where its processing power and I/O capabilities ensure rapid and accurate data handling.
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