XCV150-6BG352C
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- Mfr.Part #
- XCV150-6BG352C
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 1,540
- In Stock ：
- 1,540
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Terminations :
- 352
- Number of CLBs :
- 864
- HTS Code :
- 8542.39.00.01
- Number of Gates :
- 164674
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 3888
- JESD-30 Code :
- S-PBGA-B352
- Peak Reflow Temperature (Cel) :
- 225
- ECCN Code :
- EAR99
- Number of I/O :
- 260
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Number of LABs/CLBs :
- 864
- RAM Size :
- 6kB
- Base Part Number :
- XCV150
- Pbfree Code :
- No
- Length :
- 35mm
- Clock Frequency :
- 333MHz
- Terminal Pitch :
- 1.27mm
- Number of Inputs :
- 260
- Width :
- 35mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Lead Free :
- Contains Lead
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 1.7mm
- Qualification Status :
- Not Qualified
- Packaging :
- Tray
- Published :
- 2000
- Number of Outputs :
- 260
- Series :
- Virtex®
- Total RAM Bits :
- 49152
- Power Supplies :
- 1.2/3.62.5V
- Supply Voltage :
- 2.5V
- RoHS Status :
- Non-RoHS Compliant
- Voltage - Supply :
- 2.375V~2.625V
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Pin Count :
- 352
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Reach Compliance Code :
- not_compliant
- Datasheets
- XCV150-6BG352C
1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV150-6BG352C Overview
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 3888 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 49152. Its base part number XCV150 can be used to find related parts. The RAM si6kBe of this FPGA module reaches 6kB to ensure normal operation of the program. This FPGA is built as an array of 864 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 164674 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 333MHz . 864 CLBs are basic modules used for its architecture.
XCV150-6BG352C Features
260 I/Os
Up to 49152 RAM bits
XCV150-6BG352C Applications
There are a lot of Xilinx Inc.
XCV150-6BG352C FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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