XCV150-6BG256C
- Mfr.Part #
- XCV150-6BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 180 I/O 256BGA
- Stock
- 36,783
- In Stock :
- 36,783
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 180
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 3888
- Number of CLBs :
- 864
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- RAM Size :
- 6kB
- RoHS Status :
- Non-RoHS Compliant
- Number of Gates :
- 164674
- Lead Free :
- Contains Lead
- Width :
- 27mm
- Height Seated (Max) :
- 2.55mm
- Number of Terminations :
- 256
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 2.375V~2.625V
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Packaging :
- Tray
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 49152
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Clock Frequency :
- 333MHz
- Series :
- Virtex®
- ECCN Code :
- EAR99
- Power Supplies :
- 1.2/3.62.5V
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Terminal Form :
- Ball
- Supply Voltage :
- 2.5V
- Package / Case :
- 256-BBGA
- Number of Outputs :
- 180
- Number of LABs/CLBs :
- 864
- Base Part Number :
- XCV150
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 27mm
- Published :
- 2000
- Pin Count :
- 256
- Number of Pins :
- 256
- Datasheets
- XCV150-6BG256C
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FPGAs AMD Xilinx XCV150-6BG256C Overview
The AMD Xilinx XCV150-6BG256C is a robust FPGA (Field Programmable Gate Array) designed to meet the versatile needs of modern digital circuits. This device offers a flexible solution for designers looking to leverage the high performance and programmable capabilities of FPGAs in their projects. With an array of 180 I/O pins packaged in a compact 256BGA format, the XCV150-6BG256C is ideal for applications requiring a high degree of integration and surface area efficiency. Its capacity to handle complex digital computations while maintaining low power consumption makes it an indispensable component in the design of sophisticated electronic systems.
XCV150-6BG256C Features
The XCV150-6BG256C FPGA is characterized by its high configurability and powerful specifications. It supports a wide range of digital and mixed-signal applications, thanks to its ample I/O interfaces and advanced programmable logic. The 256BGA package ensures a minimal footprint on system boards, which is critical for space-constrained applications. Furthermore, this model's high-speed performance is suitable for rigorous computational tasks, offering designers both flexibility and capability in a single chip.
XCV150-6BG256C Applications
- Telecommunications: Utilized in routing and switching equipment, the XCV150-6BG256C manages data flow efficiently, ensuring high-speed communication networks operate without interruption.
- Automotive: Applied in driver assistance systems, this FPGA processes multiple sensor inputs simultaneously, enabling real-time decision-making and enhancing vehicle safety.
- Industrial: In factory automation systems, the XCV150-6BG256C automates complex tasks by controlling machinery operations, optimizing both productivity and precision.
- Consumer Electronics: Used in high-definition video devices, it supports the intensive processing required for 4K video rendering and streaming, providing superior image quality and user experience.
- Medical Devices: This FPGA is crucial in medical imaging equipment, where it processes vast amounts of data from diagnostic imaging technologies, helping in the delivery of precise and fast diagnostics.
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