XCV150-5FG456C
- Mfr.Part #
- XCV150-5FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 456FBGA
- Stock
- 37,495
- In Stock :
- 37,495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Length :
- 23mm
- Qualification Status :
- Not Qualified
- ECCN Code :
- EAR99
- Terminal Pitch :
- 1mm
- Mount :
- Surface Mount
- Published :
- 2002
- Series :
- Virtex®
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of CLBs :
- 864
- Number of LABs/CLBs :
- 864
- Pbfree Code :
- No
- Base Part Number :
- XCV150
- Pin Count :
- 456
- Supply Voltage :
- 2.5V
- Number of Terminations :
- 456
- Width :
- 23mm
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 3888
- Number of Gates :
- 164674
- Number of I/O :
- 260
- Total RAM Bits :
- 49152
- RoHS Status :
- Non-RoHS Compliant
- RAM Size :
- 6kB
- Power Supplies :
- 1.2/3.62.5V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 456
- Number of Outputs :
- 260
- Lead Free :
- Contains Lead
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 2.375V~2.625V
- Package / Case :
- 456-BBGA
- Height Seated (Max) :
- 2.6mm
- Operating Temperature :
- 0°C~85°C TJ
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- 225
- Packaging :
- Tray
- Clock Frequency :
- 294MHz
- Datasheets
- XCV150-5FG456C

FPGAs AMD Xilinx XCV150-5FG456C Overview
The FPGAs AMD Xilinx XCV150-5FG456C represents a pinnacle of technological innovation in the field of programmable logic devices. This high-performance IC FPGA is designed by AMD Xilinx, a leader in the semiconductor industry, to provide a flexible, programmable solution that caters to a myriad of complex digital systems. Boasting 260 I/O options and housed in a 456FBGA package, this FPGA enables efficient, scalable designs in demanding applications. Its adaptability makes it ideal for designers looking to push the boundaries of technology in both commercial and industrial applications. The product's robust feature set ensures it can meet the stringent requirements of a wide range of uses, from data processing to real-time system management.
XCV150-5FG456C Features
This particular model, the XCV150-5FG456C, includes several key features that make it a standout choice for system designers:
- High I/O count (260) for versatile connectivity.
- Compact 456FBGA packaging for reduced board space and improved thermal management.
- Advanced security features for intellectual property protection.
- High-speed DSP slices for efficient data handling and processing.
- Extensive logic resources for complex algorithm implementations.
XCV150-5FG456C Applications
- Telecommunications Infrastructure:
The high I/O capacity and advanced processing capabilities of the XCV150-5FG456C make it ideal for deployment in telecommunications equipment, supporting complex signal processing tasks and connectivity management.
- Automotive Driver Assistance Systems:
This FPGA can handle multiple high-speed inputs and outputs simultaneously, making it suitable for integration into advanced driver-assistance systems (ADAS) where real-time processing is crucial.
- Industrial Automation:
With its robust feature set, the XCV150-5FG456C supports the sophisticated control systems required in modern industrial automation, enhancing operational efficiency and reliability.
- Aerospace and Defense:
The device’s high level of programmability and security features are essential for aerospace and defense applications, where adaptable, secure, and reliable electronic systems are vital.
- Consumer Electronics:
Used in high-performance consumer electronics, the FPGA facilitates the efficient management of data-intensive applications, such as virtual reality systems and smart home devices.
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