XCV150-5FG256C
- Mfr.Part #
- XCV150-5FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 33,022
- In Stock :
- 33,022
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 2.375V~2.625V
- Lead Free :
- Contains Lead
- Total RAM Bits :
- 49152
- Number of Gates :
- 164674
- Power Supplies :
- 1.2/3.62.5V
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Pin Count :
- 256
- Mount :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Series :
- Virtex®
- Package / Case :
- 256-BGA
- Published :
- 2002
- Base Part Number :
- XCV150
- Number of Outputs :
- 176
- JESD-30 Code :
- S-PBGA-B256
- Number of Logic Elements/Cells :
- 3888
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2mm
- Number of I/O :
- 176
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Number of CLBs :
- 864
- Number of LABs/CLBs :
- 864
- Peak Reflow Temperature (Cel) :
- 225
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Length :
- 17mm
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 2.5V
- RAM Size :
- 6kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Number of Inputs :
- 176
- Clock Frequency :
- 294MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Width :
- 17mm
- ECCN Code :
- EAR99
- Number of Terminations :
- 256
- Terminal Position :
- BOTTOM
- Datasheets
- XCV150-5FG256C

FPGAs AMD Xilinx XCV150-5FG256C Overview
Introducing the FPGAs AMD Xilinx XCV150-5FG256C, a highly versatile and powerful field-programmable gate array (FPGA) designed to meet the demanding needs of modern digital applications. Manufactured by AMD Xilinx, this FPGA is tailored for designers who require a robust platform for developing high-speed, complex digital circuits. The XCV150-5FG256C offers a substantial I/O capacity and is packaged in a compact 256FBGA, making it an ideal choice for space-constrained applications.
XCV150-5FG256C Features
The XCV150-5FG256C FPGA is notable for its advanced features that support extensive applications. Key features include 176 I/O pins that provide ample connectivity for various peripherals and devices. The 256FBGA package ensures a minimal footprint while maintaining high functionality and heat dissipation. This product supports a wide range of logic design tasks with enhanced performance and flexibility.
XCV150-5FG256C Applications
- Telecommunications Equipment: Utilizes the high I/O count for processing and routing large data streams effectively in routers and switchers.
- Automotive Systems: Employs its robust processing capabilities for real-time sensor data processing and control units in advanced driver-assistance systems (ADAS).
- Industrial Automation: Ideal for managing complex control systems and operational processes in automated production lines.
- Consumer Electronics: Supports high-performance requirements for video processing, gaming consoles, and smart home devices.
- Medical Devices: Provides the necessary reliability and processing power for critical medical imaging and diagnostic equipment.
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