XCV150-4FG456C
- Mfr.Part #
- XCV150-4FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 456FBGA
- Stock
- 8,596
- In Stock :
- 8,596
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Pin Count :
- 456
- RoHS Status :
- Non-RoHS Compliant
- Number of Pins :
- 456
- Packaging :
- Tray
- Number of Gates :
- 164674
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Voltage - Supply :
- 2.375V~2.625V
- Clock Frequency :
- 250MHz
- Supply Voltage :
- 2.5V
- Mounting Type :
- Surface Mount
- Number of I/O :
- 260
- Height Seated (Max) :
- 2.6mm
- Published :
- 2000
- Package / Case :
- 456-BBGA
- Pbfree Code :
- No
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Total RAM Bits :
- 49152
- Number of Outputs :
- 260
- HTS Code :
- 8542.39.00.01
- Number of CLBs :
- 864
- Power Supplies :
- 1.2/3.62.5V
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XCV150
- Width :
- 23mm
- RAM Size :
- 6kB
- Number of Logic Elements/Cells :
- 3888
- Series :
- Virtex®
- Reach Compliance Code :
- not_compliant
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 864
- Qualification Status :
- Not Qualified
- Length :
- 23mm
- JESD-609 Code :
- e0
- Number of Terminations :
- 456
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Contains Lead
- ECCN Code :
- EAR99
- Datasheets
- XCV150-4FG456C
XCV150-4FG456C Documents

FPGAs AMD Xilinx XCV150-4FG456C Overview
The AMD Xilinx XCV150-4FG456C is a high-performance Field Programmable Gate Array (FPGA) designed for versatile applications across various industries. This FPGA enables engineers to customize their digital logic solutions, offering a flexible and scalable architecture ideal for a wide range of technological innovations. With its robust 456FBGA packaging, the XCV150-4FG456C ensures a reliable solution for complex digital environments, supporting efficient power management and high-speed signal processing capabilities. This product is an essential component for developers looking to optimize system performance and reliability in demanding applications.
XCV150-4FG456C Features
- 260 I/O pins for extensive connectivity and interfacing capabilities.
- Dense 456-pin Fine-Pitch Ball Grid Array (FBGA) package, facilitating compact and efficient designs.
- Configurable logic blocks for tailored functionality and optimized performance.
- High integration suitable for advanced digital circuit designs.
- Support for a wide array of design tools from AMD Xilinx, easing development and deployment.
XCV150-4FG456C Applications
- Telecommunications Equipment: Utilized in routers and switches for managing data traffic efficiently.
- Data Centers: Key in scalable server architectures, improving processing capabilities and data management.
- Automotive Systems: Integral in driver assistance systems, contributing to safer and smarter vehicle functionalities.
- Consumer Electronics: Used in high-definition multimedia interfaces and gaming consoles for enhanced user experiences.
- Industrial Automation: Facilitates robust control systems in manufacturing processes, improving operational efficiency.
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