XCV150-4BG256I

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Mfr.Part #
XCV150-4BG256I
Manufacturer
AMD Xilinx
Package / Case
256-BBGA
Datasheet
Download
Description
IC FPGA 180 I/O 256BGA
Stock
27,066
In Stock :
27,066

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Total RAM Bits :
49152
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Height Seated (Max) :
2.55mm
Pin Count :
256
Peak Reflow Temperature (Cel) :
225
Number of Gates :
164674
RoHS Status :
Non-RoHS Compliant
Width :
27mm
Published :
2000
Voltage - Supply :
2.375V~2.625V
Speed Grade :
4
ECCN Code :
EAR99
Operating Supply Voltage :
2.5V
Terminal Form :
Ball
Terminal Pitch :
1.27mm
Series :
Virtex®
Length :
27mm
Number of I/O :
180
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Outputs :
180
Number of Terminations :
256
Lead Free :
Contains Lead
Number of Logic Elements/Cells :
3888
Combinatorial Delay of a CLB-Max :
0.8 ns
Operating Temperature :
-40°C~100°C TJ
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pbfree Code :
No
Packaging :
Tray
Supply Voltage :
2.5V
JESD-609 Code :
e0
Number of CLBs :
864
RAM Size :
6kB
Terminal Position :
BOTTOM
Number of LABs/CLBs :
864
Base Part Number :
XCV150
Mounting Type :
Surface Mount
Radiation Hardening :
No
Time@Peak Reflow Temperature-Max (s) :
30
Package / Case :
256-BBGA
Number of Pins :
256
Clock Frequency :
250MHz
Datasheets
XCV150-4BG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV150-4BG256I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Operating Temperature:-40°C~100°C TJ, Base Part Number:XCV150, Mounting Type:Surface Mount, Package / Case:256-BBGA, Number of Pins:256, XCV150-4BG256I pinout, XCV150-4BG256I datasheet PDF, XCV150-4BG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV150-4BG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV150-4BG256I


FPGAs AMD Xilinx XCV150-4BG256I Overview

The FPGAs AMD Xilinx XCV150-4BG256I is a high-performance, field-programmable gate array designed to meet the needs of demanding applications in various industries. Manufactured by AMD Xilinx, this FPGA is equipped with 180 programmable I/O ports and is packaged in a compact 256-ball BGA (Ball Grid Array). It is particularly suitable for environments requiring high-speed data processing and flexible hardware configurations. With its robust feature set and adaptability, the XCV150-4BG256I provides a reliable platform for developing complex digital circuits, significantly reducing development time and costs for B2B clients looking to purchase in bulk.

XCV150-4BG256I Features

The XCV150-4BG256I FPGA offers a comprehensive range of features including:

  • High I/O count: 180 programmable inputs/outputs allow for versatile interfacing with a wide range of peripheral devices.
  • Advanced packaging: The 256BGA packaging ensures a compact form factor and reliable connectivity, ideal for space-constrained applications.
  • Reprogrammability: This FPGA can be reprogrammed to suit different functionalities and applications, enhancing the product lifecycle and adaptability.
  • Integrated DSP capabilities: Supports sophisticated digital signal processing tasks, making it ideal for audio, video, and data transmission applications.

XCV150-4BG256I Applications

  • Telecommunications Equipment:

    Utilized in routers, switches, and other network infrastructure devices, the XCV150-4BG256I enhances processing capabilities and supports high-speed data communications.

  • Consumer Electronics:

    Employs in devices such as high-definition televisions and gaming consoles, where fast signal processing is essential for enhanced user experiences.

  • Automotive Systems:

    Integrates into advanced driver-assistance systems (ADAS), providing the necessary processing power for real-time decision making and vehicle monitoring.

  • Industrial Automation:

    Enables sophisticated control systems for machinery and production processes, improving operational efficiency and reliability in harsh industrial environments.

  • Medical Devices:

    Applied in medical imaging systems like MRI and ultrasound equipment, offering the necessary computational power for complex image processing tasks.

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