XCV100E-8BG352C

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Mfr.Part #
XCV100E-8BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 196 I/O 352MBGA
Stock
26,977
In Stock :
26,977

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pbfree Code :
No
ECCN Code :
EAR99
Operating Temperature :
0°C~85°C TJ
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
416MHz
Packaging :
Tray
Voltage - Supply :
1.71V~1.89V
RAM Size :
10kB
Terminal Finish :
Tin/Lead (Sn63Pb37)
Height Seated (Max) :
1.7mm
Number of CLBs :
600
Number of Outputs :
196
Terminal Form :
Ball
Pin Count :
352
Package / Case :
352-LBGA Exposed Pad, Metal
Mount :
Surface Mount
Number of Gates :
128236
Total RAM Bits :
81920
Combinatorial Delay of a CLB-Max :
0.4 ns
Number of Equivalent Gates :
32400
Width :
35mm
Number of Logic Elements/Cells :
2700
Length :
35mm
Number of Terminations :
352
Number of Inputs :
196
Supply Voltage :
1.8V
Lead Free :
Contains Lead
JESD-30 Code :
S-PBGA-B352
Base Part Number :
XCV100E
Mounting Type :
Surface Mount
JESD-609 Code :
e0
Number of LABs/CLBs :
600
Terminal Pitch :
1.27mm
Number of I/O :
196
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
8
Operating Supply Voltage :
1.8V
Series :
Virtex®-E
RoHS Status :
Non-RoHS Compliant
Radiation Hardening :
No
Published :
1999
Datasheets
XCV100E-8BG352C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-8BG352C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:352-LBGA Exposed Pad, Metal, Number of Terminations:352, Base Part Number:XCV100E, Mounting Type:Surface Mount, XCV100E-8BG352C pinout, XCV100E-8BG352C datasheet PDF, XCV100E-8BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-8BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

XCV100E-8BG352C Overview


As part of the 352-LBGA Exposed Pad, Metal package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 196 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 2700 logic elements/cells. It is powered from a supply voltage of 1.8V. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.71V~1.89V . It is a type of FPGA that belongs to the Virtex®-E series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. In this device, there are 196 outputs that can be used. In order to save space, this FPGA model has been contained in Tray. There are a total of 352 terminations. This device has 81920 RAM bits, which is the number of RAM bits that this device offers. Its base part number XCV100E can be used to find parts that are related to it. Fpga electronics is important that this FPGA module has a RAM si10kBe of 10kB in order to ensure that the program will run normally. The FPGA consists of 600 LABs/CLBs. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1.8V supply voltage. The basic building block of this system consists of 128236 gates. There are a total of 352 pins on this device. Typically, it uses a crystal oscillating at 416MHz in order to operate. Its architecture is based on 600 CLBs. 32400 equivalent gates are used in the FPGA implementation.

XCV100E-8BG352C Features


196 I/Os
Up to 81920 RAM bits


XCV100E-8BG352C Applications


There are a lot of Xilinx Inc.
XCV100E-8BG352C FPGAs applications.


  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
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