XCV100E-7BG352I

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Mfr.Part #
XCV100E-7BG352I
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 196 I/O 352MBGA
Stock
45,331
In Stock :
45,331

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Package / Case :
352-LBGA Exposed Pad, Metal
ECCN Code :
EAR99
Radiation Hardening :
No
Mounting Type :
Surface Mount
Number of LABs/CLBs :
600
JESD-30 Code :
S-PBGA-B352
RAM Size :
10kB
Number of Outputs :
196
Length :
35mm
Clock Frequency :
400MHz
Time@Peak Reflow Temperature-Max (s) :
30
Packaging :
Tray
JESD-609 Code :
e0
Width :
35mm
Total RAM Bits :
81920
Number of Inputs :
196
Operating Temperature :
-40°C~100°C TJ
Published :
1999
Mount :
Surface Mount
Number of Gates :
128236
Number of Logic Elements/Cells :
2700
Number of CLBs :
600
Number of I/O :
196
Base Part Number :
XCV100E
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
225
Operating Supply Voltage :
1.8V
Pin Count :
352
HTS Code :
8542.39.00.01
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
352
Lead Free :
Contains Lead
Voltage - Supply :
1.71V~1.89V
Speed Grade :
7
Number of Equivalent Gates :
32400
Series :
Virtex®-E
Supply Voltage :
1.8V
Combinatorial Delay of a CLB-Max :
0.42 ns
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Pbfree Code :
No
Datasheets
XCV100E-7BG352I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-7BG352I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:352-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Base Part Number:XCV100E, Number of Terminations:352, XCV100E-7BG352I pinout, XCV100E-7BG352I datasheet PDF, XCV100E-7BG352I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-7BG352I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 352

XCV100E-7BG352I Overview


Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 196 I/Os for transferring data in a more coherent manner. There are 2700 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 196 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 81920. Its base part number XCV100E can be used to find related parts. The RAM si10kBe of this FPGA module reaches 10kB to ensure normal operation of the program. This FPGA is built as an array of 600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Its basic building block contains 128236 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 400MHz . 600 CLBs are basic modules used for its architecture. 32400 equivalent gates are used for the design implement in the FPGA.

XCV100E-7BG352I Features


196 I/Os
Up to 81920 RAM bits


XCV100E-7BG352I Applications


There are a lot of Xilinx Inc.
XCV100E-7BG352I FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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