XCV100E-6FG256I

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Mfr.Part #
XCV100E-6FG256I
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
37,156
In Stock :
37,156

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of CLBs :
600
Radiation Hardening :
No
Base Part Number :
XCV100E
Number of Gates :
128236
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Lead Free :
Contains Lead
JESD-609 Code :
e0
ECCN Code :
EAR99
Package / Case :
256-BGA
RAM Size :
10kB
Number of Equivalent Gates :
32400
Mount :
Surface Mount
Published :
2006
Terminal Pitch :
1mm
Number of I/O :
176
Voltage - Supply :
1.71V~1.89V
Number of Terminations :
256
Clock Frequency :
357MHz
Series :
Virtex®-E
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
Ball
Height Seated (Max) :
2mm
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.8V
Total RAM Bits :
81920
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
17mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Pin Count :
256
Peak Reflow Temperature (Cel) :
225
Speed Grade :
6
Number of Logic Elements/Cells :
2700
Width :
17mm
Number of LABs/CLBs :
600
Number of Pins :
256
Combinatorial Delay of a CLB-Max :
0.47 ns
Operating Supply Voltage :
1.8V
Pbfree Code :
No
HTS Code :
8542.39.00.01
Number of Outputs :
176
Datasheets
XCV100E-6FG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-6FG256I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV100E, Mounting Type:Surface Mount, Package / Case:256-BGA, Number of Terminations:256, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, XCV100E-6FG256I pinout, XCV100E-6FG256I datasheet PDF, XCV100E-6FG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-6FG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV100E-6FG256I


FPGAs AMD Xilinx XCV100E-6FG256I Overview

The AMD Xilinx XCV100E-6FG256I is a high-performance FPGA (Field Programmable Gate Array) designed to meet the demanding requirements of modern digital circuits. This IC FPGA, encapsulated in a 256FBGA package, boasts 176 I/O pins, enabling versatile interfacing with a wide range of peripherals and devices. Ideal for applications requiring rapid prototyping and flexible hardware configurations, this product allows engineers to quickly iterate and implement changes during the development cycle, significantly reducing time to market. The use of FPGAs AMD Xilinx XCV100E-6FG256I in your projects ensures a reliable and efficient solution for handling complex logic operations and data processing tasks.

XCV100E-6FG256I Features

The XCV100E-6FG256I FPGA is packed with features suitable for a broad spectrum of applications. It supports a 6 ns clock rate, providing substantial speed for processing tasks, and is built using a low-power architecture to ensure energy efficiency. The 256FBGA package is not only robust but also compact, making it an excellent choice for space-constrained applications. Moreover, its high I/O count facilitates extensive interfacing capabilities, making this FPGA an adaptable choice for various digital solutions.

XCV100E-6FG256I Applications

  • Telecommunications: Utilized in networking hardware such as routers and switches, where its ability to process high-speed signals helps maintain efficient data flow and connectivity.
  • Automotive: Integrated into driver assistance systems, where rapid signal processing is crucial for real-time decision-making and system responsiveness.
  • Industrial: Employed in control systems for machinery and production lines, providing the flexibility to reprogram logic circuits as manufacturing needs evolve.
  • Consumer Electronics: Used in high-definition multimedia interfaces and video processing units, enhancing the quality and performance of consumer devices.
  • Aerospace: Crucial in satellite communication systems, where robust and adaptable signal processing capabilities are required for reliable operation in harsh environments.
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