XCV100E-6FG256C

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Mfr.Part #
XCV100E-6FG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
21,561
In Stock :
21,561

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
EAR99
Speed Grade :
6
Base Part Number :
XCV100E
Terminal Position :
BOTTOM
RAM Size :
10kB
Operating Temperature :
0°C~85°C TJ
Number of I/O :
176
Lead Free :
Contains Lead
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
RoHS Status :
Non-RoHS Compliant
Length :
17mm
Package / Case :
256-BGA
HTS Code :
8542.39.00.01
Radiation Hardening :
No
Number of Logic Elements/Cells :
2700
Number of Gates :
128236
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Terminal Form :
Ball
Number of Equivalent Gates :
32400
Combinatorial Delay of a CLB-Max :
0.47 ns
Pin Count :
256
Number of Pins :
256
Number of LABs/CLBs :
600
Width :
17mm
Time@Peak Reflow Temperature-Max (s) :
30
Height Seated (Max) :
2mm
Supply Voltage :
1.8V
Packaging :
Tray
Published :
2003
Operating Supply Voltage :
1.8V
Clock Frequency :
357MHz
Voltage - Supply :
1.71V~1.89V
Mount :
Surface Mount
Number of Outputs :
176
Total RAM Bits :
81920
Number of Terminations :
256
Peak Reflow Temperature (Cel) :
225
Number of CLBs :
600
Pbfree Code :
No
Series :
Virtex®-E
Datasheets
XCV100E-6FG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-6FG256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV100E, Operating Temperature:0°C~85°C TJ, Package / Case:256-BGA, Mounting Type:Surface Mount, Number of Pins:256, Number of Terminations:256, XCV100E-6FG256C pinout, XCV100E-6FG256C datasheet PDF, XCV100E-6FG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100E-6FG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV100E-6FG256C


FPGAs AMD Xilinx XCV100E-6FG256C Overview

The FPGAs AMD Xilinx XCV100E-6FG256C is a highly capable field programmable gate array (FPGA) that offers robust solutions for a variety of complex digital and logic circuit designs. This component, manufactured by AMD Xilinx, stands out for its versatility and high-performance capabilities, making it an ideal choice for designers looking to leverage speed and efficiency in their hardware implementations. With its substantial array of 176 I/O pins housed in a compact 256FBGA package, the XCV100E-6FG256C is designed to meet the rigorous demands of modern electronic environments, ensuring optimal functionality and scalability.

XCV100E-6FG256C Features

The XCV100E-6FG256C FPGA includes several features that enhance its usability and functionality in complex electronic designs. Key features include a high I/O pin count, a dense 256FBGA packaging, and a configuration that supports multiple logic design implementations, providing a flexible platform for hardware developers. The device's robust architecture allows for efficient heat dissipation and improved signal integrity, which are crucial for maintaining performance under intensive operational conditions.

XCV100E-6FG256C Applications

  • Data Processing Units: Utilized in servers and high-performance computing systems to manage and process large datasets efficiently.
  • Telecommunications: Employed in communication infrastructure to support complex signal processing tasks essential for modern telecommunications.
  • Automotive Electronics: Integrated into automotive systems for managing vehicle dynamics and safety-related functionalities.
  • Consumer Electronics: Used in devices like high-definition televisions and gaming consoles to enhance processing capabilities and support advanced user interfaces.
  • Industrial Automation: Applied in control systems for manufacturing processes, improving automation reliability and precision.
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