XCV1000E-6FG900C
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- Mfr.Part #
- XCV1000E-6FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 900FBGA
- Stock
- 13,214
- In Stock ：
- 13,214
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Base Part Number :
- XCV1000E
- Mount :
- Surface Mount
- Terminal Pitch :
- 1mm
- Speed Grade :
- 6
- Pin Count :
- 900
- Width :
- 31mm
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Number of Terminations :
- 900
- Radiation Hardening :
- No
- Terminal Form :
- Ball
- Number of Outputs :
- 660
- Number of LABs/CLBs :
- 6144
- Operating Supply Voltage :
- 1.8V
- Number of I/O :
- 660
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Virtex®-E
- Packaging :
- Tray
- RAM Size :
- 48kB
- Number of Gates :
- 1569178
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Package / Case :
- 900-BBGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- 3A991.D
- Mounting Type :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 1.8V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Pins :
- 900
- Published :
- 1999
- Total RAM Bits :
- 393216
- Voltage - Supply :
- 1.71V~1.89V
- Length :
- 31mm
- Number of Logic Elements/Cells :
- 27648
- Lead Free :
- Contains Lead
- Clock Frequency :
- 357MHz
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Datasheets
- XCV1000E-6FG900C
XCV1000E-6FG900C Documents
FPGAs AMD Xilinx XCV1000E-6FG900C Overview
Introducing the FPGAs AMD Xilinx XCV1000E-6FG900C, a high-performance Field Programmable Gate Array designed by AMD Xilinx, tailored for applications requiring high I/O bandwidth and superior logic integration. This device encapsulates robustness with its 660 I/Os housed in a compact 900FBGA package, making it ideal for sophisticated and space-constrained designs. The XCV1000E-6FG900C stands out in its class by providing scalable solutions that meet the intricate requirements of today’s dynamic technology landscapes, ensuring both flexibility and efficiency for designers and engineers aiming to accelerate time to market.
XCV1000E-6FG900C Features
The XCV1000E-6FG900C from AMD Xilinx features a dense 900-pin ball grid array (FBGA) packaging which optimizes the board space and enhances thermal management. With 660 I/O pins, this FPGA provides ample connectivity for various peripherals and interfaces. The high configurability and programmability of this model allow for tailored application-specific solutions, making it a versatile choice for a broad range of industrial applications.
XCV1000E-6FG900C Applications
- Telecommunications: Utilized in base station development, network routers, and switches, providing the necessary processing power and flexibility to manage vast data flows and high-speed signal processing.
- Data Centers: Integral in server farms and cloud computing infrastructures for handling complex algorithms, data sorting, and storage management efficiently.
- Medical Imaging: Applied in advanced medical imaging systems such as MRI and CT scanners, enhancing image processing capabilities and patient diagnostic tools.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors and cameras, ensuring real-time decision-making and system responsiveness.
- Aerospace and Defense: Deployed in avionics and satellite communications systems, offering robustness in signal processing and control tasks under extreme environmental conditions.
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