XCV1000E-6BG560I

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Mfr.Part #
XCV1000E-6BG560I
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
13,227
In Stock :
13,227

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
XCV1000E
Published :
2006
Lead Free :
Contains Lead
Terminal Pitch :
1.27mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
42.5mm
Number of Gates :
1569178
Operating Temperature :
-40°C~100°C TJ
Package / Case :
560-LBGA Exposed Pad, Metal
Voltage - Supply :
1.71V~1.89V
ECCN Code :
3A991.D
Height Seated (Max) :
1.7mm
Packaging :
Tray
Number of LABs/CLBs :
6144
Radiation Hardening :
No
Pbfree Code :
No
RAM Size :
48kB
Number of Inputs :
404
Operating Supply Voltage :
1.8V
Number of I/O :
404
Time@Peak Reflow Temperature-Max (s) :
30
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
393216
Number of Terminations :
560
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
27648
Length :
42.5mm
Combinatorial Delay of a CLB-Max :
0.47 ns
Series :
Virtex®-E
Speed Grade :
6
Pin Count :
560
RoHS Status :
Non-RoHS Compliant
JESD-609 Code :
e0
Terminal Form :
Ball
Clock Frequency :
357MHz
Supply Voltage :
1.8V
Terminal Position :
BOTTOM
Number of Outputs :
404
Mounting Type :
Surface Mount
Mount :
Surface Mount
Datasheets
XCV1000E-6BG560I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1000E-6BG560I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV1000E, Operating Temperature:-40°C~100°C TJ, Package / Case:560-LBGA Exposed Pad, Metal, Number of Terminations:560, Mounting Type:Surface Mount, XCV1000E-6BG560I pinout, XCV1000E-6BG560I datasheet PDF, XCV1000E-6BG560I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1000E-6BG560I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV1000E-6BG560I Overview


In the package 560-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 404 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 27648 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 404 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 560. Fpga electronics is worth mentioning that this device provides 393216 bfpga electronics s of RAM. XCV1000E is the base part number that can be used to identify related parts. The RAM si48kBe of this FPGA module reaches 48kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 6144 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 1569178 gates. I am going to present you with a device that is equipped with 560 pins. Fpga semiconductor typically uses a crystal oscillating at 357MHz.

XCV1000E-6BG560I Features


404 I/Os
Up to 393216 RAM bits


XCV1000E-6BG560I Applications


There are a lot of Xilinx Inc.
XCV1000E-6BG560I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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