XCV1000-4FG680C

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Mfr.Part #
XCV1000-4FG680C
Manufacturer
AMD Xilinx
Package / Case
680-LBGA Exposed Pad
Datasheet
Download
Description
IC FPGA 512 I/O 680FTEBGA
Stock
48,288
In Stock :
48,288

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
XCV1000
Packaging :
Tray
Mount :
Surface Mount
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn63Pb37)
ECCN Code :
EAR99
Published :
2000
Number of Inputs :
512
Lead Free :
Contains Lead
Voltage - Supply :
2.375V~2.625V
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
512
Length :
40mm
Height Seated (Max) :
1.7mm
RoHS Status :
Non-RoHS Compliant
Pin Count :
680
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
131072
Supply Voltage :
2.5V
Number of LABs/CLBs :
6144
Power Supplies :
1.2/3.62.5V
Number of Gates :
1124022
Reach Compliance Code :
not_compliant
Qualification Status :
Not Qualified
Clock Frequency :
250MHz
Number of Terminations :
680
Package / Case :
680-LBGA Exposed Pad
Number of Outputs :
512
JESD-609 Code :
e0
Number of Logic Elements/Cells :
27648
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
40mm
RAM Size :
16kB
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B680
Peak Reflow Temperature (Cel) :
225
Terminal Position :
BOTTOM
Combinatorial Delay of a CLB-Max :
0.8 ns
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®
Datasheets
XCV1000-4FG680C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1000-4FG680C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV1000, Operating Temperature:0°C~85°C TJ, Number of Terminations:680, Package / Case:680-LBGA Exposed Pad, Mounting Type:Surface Mount, XCV1000-4FG680C pinout, XCV1000-4FG680C datasheet PDF, XCV1000-4FG680C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV1000-4FG680C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.7mm mm FPGAs Virtex® Series 680-LBGA Exposed Pad 1mm mm 680

XCV1000-4FG680C Overview


In the package 680-LBGA Exposed Pad, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 27648 logic elements/cells. Supply voltage is 2.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 512 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 680. Fpga electronics is worth mentioning that this device provides 131072 bfpga electronics s of RAM. XCV1000 is the base part number that can be used to identify related parts. The RAM si16kBe of this FPGA module reaches 16kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 6144 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This is a battery operated device that operates on 1.2/3.62.5V. A basic building block for this type of building block consists of 1124022 gates. I am going to present you with a device that is equipped with 680 pins. Fpga semiconductor typically uses a crystal oscillating at 250MHz.

XCV1000-4FG680C Features


512 I/Os
Up to 131072 RAM bits


XCV1000-4FG680C Applications


There are a lot of Xilinx Inc.
XCV1000-4FG680C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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