XCV100-6FG256C

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Mfr.Part #
XCV100-6FG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
1,168
In Stock :
1,168

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2000
Length :
17mm
Number of Gates :
108904
JESD-609 Code :
e0
Height Seated (Max) :
2mm
Number of Outputs :
176
Pbfree Code :
No
Mount :
Surface Mount
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
225
Terminal Pitch :
1mm
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Number of LABs/CLBs :
600
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status :
Not Qualified
Terminal Position :
BOTTOM
Number of CLBs :
600
Operating Temperature :
0°C~85°C TJ
JESD-30 Code :
S-PBGA-B256
Package / Case :
256-BGA
Series :
Virtex®
Voltage - Supply :
2.375V~2.625V
Combinatorial Delay of a CLB-Max :
0.6 ns
Number of Logic Elements/Cells :
2700
Lead Free :
Contains Lead
Number of Terminations :
256
Base Part Number :
XCV100
Total RAM Bits :
40960
Number of Inputs :
176
Power Supplies :
1.5/3.32.5V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Clock Frequency :
333MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
176
Width :
17mm
Reach Compliance Code :
not_compliant
Supply Voltage :
2.5V
RoHS Status :
Non-RoHS Compliant
RAM Size :
5kB
Pin Count :
256
Datasheets
XCV100-6FG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100-6FG256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:256-BGA, Number of Terminations:256, Base Part Number:XCV100, XCV100-6FG256C pinout, XCV100-6FG256C datasheet PDF, XCV100-6FG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV100-6FG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV100-6FG256C


FPGAs AMD Xilinx XCV100-6FG256C Overview

The FPGAs AMD Xilinx XCV100-6FG256C is a high-performance Field Programmable Gate Array designed to meet the intricate needs of modern digital circuits. With 176 user I/O pins and housed in a compact 256FBGA package, this FPGA is capable of supporting a wide range of applications, from industrial to telecommunications. It is tailored for designers who need a flexible and programmable solution, offering significant advantages in terms of speed, power efficiency, and integration capabilities. This device represents a robust platform for developing advanced digital systems requiring high logic and pattern capabilities.

XCV100-6FG256C Features

The XCV100-6FG256C FPGA from AMD Xilinx comes equipped with features that enhance its functionality and reliability in complex digital environments. Key features include a large number of programmable logic cells, high I/O count for extensive connectivity options, and support for advanced digital signal processing. Its small form factor (256FBGA) makes it ideal for applications where space is at a premium, while still providing the performance needed to drive sophisticated digital systems.

XCV100-6FG256C Applications

  • Telecommunications: Utilized in communication infrastructure to facilitate complex signal processing tasks, routing, and data traffic management, ensuring efficient network operations.
  • Automotive Electronics: Applied in vehicle control systems for functions such as sensor data processing and real-time decision-making, enhancing both performance and safety.
  • Consumer Electronics: Integral to the development of consumer devices like gaming consoles and smart TVs, where high-speed processing and advanced graphics are essential.
  • Industrial Automation: Employed in control systems for automated production lines, improving operational efficiency and reliability through high-speed computations and versatile programmability.
  • Medical Devices: Critical in medical imaging systems, enabling complex image processing applications required for diagnostics and treatment planning.
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