XC7K70T-1FBG676C
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- Mfr.Part #
- XC7K70T-1FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 300 I/O 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Kintex®-7
- Package / Case :
- 676-BBGA, FCBGA
- Qualification Status :
- Not Qualified
- RoHS Status :
- ROHS3 Compliant
- JESD-609 Code :
- e1
- Base Part Number :
- XC7K70T
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 300
- Length :
- 27mm
- Total RAM Bits :
- 4976640
- Power Supplies :
- 11.83.3V
- Number of Outputs :
- 300
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 607.5kB
- Mounting Type :
- Surface Mount
- Width :
- 27mm
- Pin Count :
- 676
- Clock Frequency :
- 1098MHz
- Number of Registers :
- 82000
- Pbfree Code :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Speed Grade :
- -1
- Terminal Form :
- Ball
- Published :
- 2010
- Number of LABs/CLBs :
- 5125
- Surface Mount :
- yes
- Number of Pins :
- 676
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 676
- Height Seated (Max) :
- 2.54mm
- Contact Plating :
- Copper, Silver, Tin
- Supply Voltage :
- 1V
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Voltage - Supply :
- 0.97V~1.03V
- Number of Logic Elements/Cells :
- 65600
- Datasheets
- XC7K70T-1FBG676C
FPGAs AMD Xilinx XC7K70T-1FBG676C Overview
The FPGAs AMD Xilinx XC7K70T-1FBG676C is a highly versatile and powerful Field Programmable Gate Array designed to meet the evolving demands of modern electronics. Manufactured by AMD Xilinx, this FPGA features a robust 676-pin FCBGA package, making it suitable for high-density integration that requires a compact footprint without sacrificing performance. With its ability to handle up to 300 I/O points, this FPGA offers exceptional flexibility and scalability, catering to a diverse range of applications from consumer electronics to industrial automation. The integration of advanced technology in the XC7K70T-1FBG676C facilitates efficient design cycles and speed-to-market, making it a preferred choice for developers looking to leverage FPGA advantages in product development.
XC7K70T-1FBG676C Features
The XC7K70T-1FBG676C FPGA from AMD Xilinx is equipped with several key features that enhance its utility and performance. The 676FCBGA packaging efficiently manages the complex circuitry while maintaining a smaller form factor. With 300 available I/O points, it provides ample connectivity for multiple peripherals and interfaces. The FPGA is designed for optimal power efficiency, which is crucial for portable and high-performance devices. Additionally, its programmability allows for reconfiguration of logic to suit specific application needs, adding a layer of flexibility unmatched by traditional fixed-function chips.
XC7K70T-1FBG676C Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and gaming consoles, where its ability to handle multiple I/Os and its small form factor are essential for compact, high-performance electronics.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) and infotainment systems, providing the necessary processing power and connectivity for complex automotive applications.
- Industrial Automation: Serves as a control unit in automated manufacturing equipment, where its robust I/O capabilities and adaptability to different environments enhance system reliability and efficiency.
- Telecommunications: Used in networking equipment, such as routers and switches, where high I/O count and programmability enable efficient data management and signal processing.
- Medical Devices: Integrated into medical imaging systems like ultrasound and MRI, supporting complex digital processing tasks that require high levels of precision and reliability.
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