XC7K325T-2FFG676C
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- Mfr.Part #
- XC7K325T-2FFG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 25475
- Speed Grade :
- -2
- Height Seated (Max) :
- 3.37mm
- Power Supplies :
- 11.83.3V
- Number of Logic Elements/Cells :
- 326080
- Pin Count :
- 676
- Number of Inputs :
- 400
- Memory Type :
- DDR3
- Number of I/O :
- 400
- JESD-609 Code :
- e1
- Number of Registers :
- 407600
- Surface Mount :
- yes
- Supply Voltage :
- 1V
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 16404480
- Number of Outputs :
- 400
- Operating Temperature :
- 0°C~85°C TJ
- Length :
- 27mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B676
- RAM Size :
- 2MB
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- XC7K325T
- Width :
- 27mm
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Factory Lead Time :
- 11 Weeks
- Number of Terminations :
- 676
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- ROHS3 Compliant
- Clock Frequency :
- 1818MHz
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Memory Size :
- 1GB
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Tray
- Voltage - Supply :
- 0.97V~1.03V
- Reach Compliance Code :
- not_compliant
- Package / Case :
- 676-BBGA, FCBGA
- Published :
- 2009
- Series :
- Kintex®-7
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Datasheets
- XC7K325T-2FFG676C
FPGAs AMD Xilinx XC7K325T-2FFG676C Overview
The AMD Xilinx XC7K325T-2FFG676C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the demands of complex digital processing applications. This model stands out in the FPGA market for its blend of flexibility, performance, and power efficiency, making it an ideal choice for designers looking to push the boundaries of technology. The XC7K325T-2FFG676C, housed in a 676-pin flip-chip BGA package, provides ample room for I/O with 400 programmable logic gates, catering to a wide range of uses from advanced computing to signal processing.
XC7K325T-2FFG676C Features
This FPGA model from AMD Xilinx boasts extensive features that enhance its utility and efficiency in high-demand settings. Key features include its high logic gate density, extensive I/O capabilities, and advanced power management technology. Additionally, the integration of high-speed DSP slices facilitates efficient data processing, while support for gigabit transceivers ensures robust data transfer rates, making the XC7K325T-2FFG676C a powerful core component for any high-performance system.
XC7K325T-2FFG676C Applications
- Data Centers: Utilized in server farms for accelerating data processing and virtualization tasks, enhancing overall efficiency and reducing latency.
- Telecommunications: Employed in communication infrastructure to handle complex signal processing tasks, such as baseband processing and network packet processing.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing multiple real-time inputs (cameras, sensors, etc.) to enhance vehicle safety and navigation.
- Medical Imaging: Used in medical diagnostic equipment for rapid image processing, helping in delivering faster and more accurate diagnoses.
- Industrial Automation: Helps in managing and controlling automated production lines, improving precision and efficiency in manufacturing processes.
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