XC7K325T-2FBG900C
- Mfr.Part #
- XC7K325T-2FBG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 500 I/O 900FCBGA
- Stock
- 16,200
- In Stock :
- 16,200
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Memory Type :
- DDR3
- Voltage - Supply :
- 0.97V~1.03V
- Total RAM Bits :
- 16404480
- Packaging :
- Tray
- Terminal Form :
- Ball
- Number of Registers :
- 407600
- Number of Terminations :
- 900
- Speed Grade :
- -2
- Pin Count :
- 900
- Base Part Number :
- XC7K325T
- Power Supplies :
- 11.83.3V
- Series :
- Kintex®-7
- Number of Pins :
- 900
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Logic Elements/Cells :
- 326080
- Height Seated (Max) :
- 2.54mm
- Terminal Pitch :
- 1mm
- Package / Case :
- 900-BBGA, FCBGA
- RAM Size :
- 2MB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pbfree Code :
- yes
- Clock Frequency :
- 1818MHz
- Number of LABs/CLBs :
- 25475
- Qualification Status :
- Not Qualified
- Number of Outputs :
- 500
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- ECCN Code :
- 3A991.D
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Published :
- 2009
- Factory Lead Time :
- 11 Weeks
- Length :
- 31mm
- Width :
- 31mm
- Memory Size :
- 1GB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Contact Plating :
- Copper, Silver, Tin
- Supply Voltage :
- 1V
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code :
- 8542.39.00.01
- Reach Compliance Code :
- not_compliant
- Mounting Type :
- Surface Mount
- Number of I/O :
- 500
- Datasheets
- XC7K325T-2FBG900C
FPGAs AMD Xilinx XC7K325T-2FBG900C Overview
The AMD Xilinx XC7K325T-2FBG900C FPGA stands out as a highly versatile and powerful component in the field of programmable logic technology. Designed for optimal performance and flexibility, this device caters to a broad spectrum of industrial applications requiring high-speed data processing and complex algorithmic functionalities. The XC7K325T-2FBG900C, with its robust 900-pin FCBGA (Flip-Chip Ball Grid Array) packaging, ensures reliable connectivity and heat dissipation, making it an ideal choice for demanding environments. Its capability to handle up to 500 I/Os allows for extensive interfacing with other components, enhancing system integration and scalability.
XC7K325T-2FBG900C Features
This FPGA model from AMD Xilinx is equipped with advanced features that support extensive applications in processing and control systems. Key features include a high-density logic configuration, low power consumption, and an integrated DSP (Digital Signal Processing) slice architecture. These attributes provide the necessary tools for developers to build highly efficient, high-performance applications with reduced development times and increased reliability.
XC7K325T-2FBG900C Applications
- Data Centers: Utilized in server management and data processing, improving efficiency and speed in large-scale operations.
- Telecommunications: Supports infrastructure for 5G technology, enhancing bandwidth and reducing latency in network communications.
- Automotive: Integrated into driver assistance systems (ADAS), contributing to safer driving through faster data processing and decision-making capabilities.
- Industrial Automation: Applied in control systems for manufacturing lines, optimizing processes through adaptable programming and real-time processing.
- Medical Equipment: Plays a crucial role in diagnostic and imaging equipment, offering precise control and fast processing capabilities necessary for modern medical technology.
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