XC7A75T-L2CSG324E
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- Mfr.Part #
- XC7A75T-L2CSG324E
- Manufacturer
- AMD Xilinx
- Package / Case
- 324-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC FPGA 210 I/O 324CSBGA
- Stock
- 2,445
- In Stock ：
- 2,445
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 1.5mm
- Number of Pins :
- 324
- Length :
- 15mm
- RoHS Status :
- ROHS3 Compliant
- Published :
- 2010
- ECCN Code :
- 3A991.D
- Combinatorial Delay of a CLB-Max :
- 1.51 ns
- Pbfree Code :
- yes
- Packaging :
- Tray
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of LABs/CLBs :
- 5900
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 210
- JESD-609 Code :
- e1
- Number of Terminations :
- 324
- Number of Registers :
- 94400
- Qualification Status :
- Not Qualified
- Power Supplies :
- 0.9V
- Total RAM Bits :
- 3870720
- Additional Feature :
- ALSO OPERATES AT 1V SUPPLY
- Mount :
- Surface Mount
- Clock Frequency :
- 1098MHz
- Number of I/O :
- 210
- Operating Supply Voltage :
- 900mV
- Terminal Pitch :
- 0.8mm
- RAM Size :
- 472.5kB
- Series :
- Artix-7
- Width :
- 15mm
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 75520
- Supply Voltage :
- 0.9V
- Operating Temperature :
- 0°C~100°C TJ
- Voltage - Supply :
- 0.95V~1.05V
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 324-LFBGA, CSPBGA
- Propagation Delay :
- 850 ps
- Factory Lead Time :
- 12 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 324
- Datasheets
- XC7A75T-L2CSG324E
FPGAs AMD Xilinx XC7A75T-L2CSG324E Overview
The AMD Xilinx XC7A75T-L2CSG324E FPGA represents a robust solution for a variety of applications requiring high-speed, flexible, and customizable digital circuitry. This high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx is particularly designed to tackle complex processing tasks in a compact and efficient 324-pin CSBGA (Chip-Scale Ball Grid Array) package. With a significant number of input/output options (210 I/Os), it allows for versatile connectivity and integration into existing technology stacks, making it an excellent choice for developers looking to harness powerful digital processing capabilities for their sophisticated electronics systems.
XC7A75T-L2CSG324E Features
This FPGA features a robust array of options that cater to a wide range of technological needs. Key features include a large number of logic cells, DSP slices for advanced digital processing, and high-speed transceivers. The 324CSBGA package ensures a minimal footprint while providing maximum functionality, which is ideal for densely packed electronic assemblies. Additionally, its low power consumption makes it suitable for portable and power-sensitive applications.
XC7A75T-L2CSG324E Applications
- Telecommunications: Utilized in data processing and signal conditioning equipment, the XC7A75T-L2CSG324E enhances the performance and reliability of telecommunications infrastructure.
- Automotive Electronics: This FPGA can be embedded in automotive systems to manage and control engine functions, in-car networking, and sensor integrations, improving overall vehicle performance and safety.
- Consumer Electronics: Ideal for high-definition multimedia interfaces and portable device applications, enhancing user experiences with rapid processing and efficient power usage.
- Industrial Automation: In industrial settings, the XC7A75T-L2CSG324E drives complex machinery and robotics, providing the flexibility needed for programmable logic controllers and real-time automation processes.
- Medical Devices: Supports critical applications in medical imaging systems, where high-speed data processing and precise control are paramount.
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