XC7A75T-1FTG256I

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Mfr.Part #
XC7A75T-1FTG256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 170 I/O 256FTBGA
Stock
1
In Stock :
1

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Number of Terminations :
256
Packaging :
Tray
RAM Size :
472.5kB
Terminal Form :
Ball
Number of I/O :
170
Package / Case :
256-LBGA
Turn On Delay Time :
1.09 ns
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Contact Plating :
Copper, Silver, Tin
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Supply Voltage :
1V
Mount :
Surface Mount
Published :
2010
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Pins :
256
Number of LABs/CLBs :
5900
JESD-609 Code :
e1
Propagation Delay :
1.09 ns
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
12 Weeks
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Logic Elements/Cells :
75520
Number of Registers :
94400
Voltage - Supply :
0.95V~1.05V
Power Supplies :
1V
Series :
Artix-7
Total RAM Bits :
3870720
Number of Outputs :
170
Operating Temperature :
-40°C~100°C TJ
Pin Count :
256
Speed Grade :
1
Qualification Status :
Not Qualified
Pbfree Code :
yes
ECCN Code :
EAR99
Datasheets
XC7A75T-1FTG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7A75T-1FTG256I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:256, Package / Case:256-LBGA, Number of Pins:256, Operating Temperature:-40°C~100°C TJ, XC7A75T-1FTG256I pinout, XC7A75T-1FTG256I datasheet PDF, XC7A75T-1FTG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7A75T-1FTG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7A75T-1FTG256I


FPGAs AMD Xilinx XC7A75T-1FTG256I Overview

The FPGAs AMD Xilinx XC7A75T-1FTG256I is a cutting-edge field-programmable gate array designed for high-performance applications that require substantial logic processing and interfacing capabilities. This device is built on AMD Xilinx's advanced technology platform, ensuring robust performance and reliability for industrial and technological applications. Ideal for demanding environments, this FPGA integrates 170 I/O pins within a compact 256FTBGA package, offering the flexibility and efficiency needed for complex digital and analog signal processing tasks. The XC7A75T-1FTG256I provides a versatile foundation for developers looking to push the boundaries of hardware acceleration and system integration.

XC7A75T-1FTG256I Features

This FPGA from AMD Xilinx boasts numerous features that make it an attractive choice for system designers. With its 170 I/O pins, it facilitates extensive peripheral connectivity and high-bandwidth interfaces. The 256FTBGA package is optimized for thermal management and minimized footprint, which is crucial for compact system designs. Additionally, the FPGA's robust design is suitable for industrial applications where temperature fluctuations and environmental factors pose a constant challenge.

XC7A75T-1FTG256I Applications

  • Industrial Automation: In industrial settings, the XC7A75T-1FTG256I can be used to control machinery, process sensors’ data, and manage actuators, streamlining operations and enhancing efficiency.
  • Data Communication: This FPGA excels in managing data transmissions by supporting high-speed interfaces, crucial for network routers, switches, and other communication infrastructure.
  • Medical Devices: The device's capability to handle complex algorithms and multiple input/output operations makes it ideal for medical imaging systems, where precision and reliability are critical.
  • Automotive: Leveraging its robust processing power, the XC7A75T-1FTG256I can be integrated into automotive systems for sensor data processing, in-vehicle networking, and autonomous driving functionalities.
  • Consumer Electronics: This FPGA is used in consumer electronics for video processing, device interfacing, and audio systems, providing a flexible platform for multimedia applications.
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