XC7A200T-L2FBG676E

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Mfr.Part #
XC7A200T-L2FBG676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 400 I/O 676FCBGA
Stock
4,930
In Stock :
4,930

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
215360
Packaging :
Tray
RAM Size :
1.6MB
HTS Code :
8542.39.00.01
Length :
27mm
Pin Count :
676
Series :
Artix-7
Mount :
Surface Mount
Mounting Type :
Surface Mount
Pbfree Code :
yes
Additional Feature :
ALSO OPERATES AT 1V SUPPLY
Combinatorial Delay of a CLB-Max :
1.51 ns
Propagation Delay :
110 ps
Number of Registers :
269200
Supply Voltage :
0.9V
Number of I/O :
400
Voltage - Supply :
0.95V~1.05V
Total RAM Bits :
13455360
Factory Lead Time :
10 Weeks
Operating Supply Voltage :
1V
JESD-609 Code :
e1
Published :
2009
Terminal Position :
BOTTOM
Terminal Form :
Ball
Package / Case :
676-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
JESD-30 Code :
S-PBGA-B676
Terminal Pitch :
1mm
Height Seated (Max) :
2.54mm
ECCN Code :
3A991.D
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
27mm
Number of Inputs :
400
Base Part Number :
XC7A200T
RoHS Status :
Non-RoHS Compliant
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of Terminations :
676
Radiation Hardening :
No
Number of Outputs :
400
Number of LABs/CLBs :
16825
Clock Frequency :
1286MHz
Operating Temperature :
0°C~100°C TJ
Power Supplies :
0.9V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7A200T-L2FBG676E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, Base Part Number:XC7A200T, Number of Terminations:676, Operating Temperature:0°C~100°C TJ, XC7A200T-L2FBG676E pinout, XC7A200T-L2FBG676E datasheet PDF, XC7A200T-L2FBG676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7A200T-L2FBG676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7A200T-L2FBG676E


FPGAs AMD Xilinx XC7A200T-L2FBG676E Overview

The FPGAs AMD Xilinx XC7A200T-L2FBG676E is a highly capable integrated circuit from AMD Xilinx, designed for versatility across numerous applications requiring field programmability and high performance. This FPGA features a dense array of logic cells and robust I/O capabilities housed in a 676-pin flip-chip ball grid array (FCBGA) package. The IC is engineered to handle complex digital computations and signal processing tasks with remarkable efficiency and speed, making it an ideal choice for advanced technology solutions in demanding environments.

XC7A200T-L2FBG676E Features

The XC7A200T-L2FBG676E FPGA boasts an impressive array of features that make it a top contender in high-performance computing applications. Key features include its 400 I/O pins, which provide extensive interfacing capabilities. Additionally, its high logic cell count enables sophisticated custom logic implementations, while the FCBGA package ensures optimal thermal management and reduced footprint on the PCB.

XC7A200T-L2FBG676E Applications

  • Data Centers: Utilized in server hardware to accelerate compute-intensive tasks such as data sorting and transaction processing, enhancing overall efficiency and performance.
  • Telecommunications: Deployed in communication infrastructure to manage signal processing operations, contributing to improved data transfer rates and reliability in network systems.
  • Automotive Systems: Integrated into driver assistance systems to perform real-time data processing, ensuring rapid response times and enhanced vehicular safety.
  • Medical Equipment: Applied in medical imaging devices to facilitate complex image processing algorithms, helping in the production of clearer and more accurate diagnostic visuals.
  • Aerospace and Defense: Used in satellite communications and radar systems, providing robust data processing capabilities that are crucial for mission-critical applications.
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