XC7A200T-L2FBG676E
- Mfr.Part #
- XC7A200T-L2FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 4,930
- In Stock :
- 4,930
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 215360
- Packaging :
- Tray
- RAM Size :
- 1.6MB
- HTS Code :
- 8542.39.00.01
- Length :
- 27mm
- Pin Count :
- 676
- Series :
- Artix-7
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Pbfree Code :
- yes
- Additional Feature :
- ALSO OPERATES AT 1V SUPPLY
- Combinatorial Delay of a CLB-Max :
- 1.51 ns
- Propagation Delay :
- 110 ps
- Number of Registers :
- 269200
- Supply Voltage :
- 0.9V
- Number of I/O :
- 400
- Voltage - Supply :
- 0.95V~1.05V
- Total RAM Bits :
- 13455360
- Factory Lead Time :
- 10 Weeks
- Operating Supply Voltage :
- 1V
- JESD-609 Code :
- e1
- Published :
- 2009
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Package / Case :
- 676-BBGA, FCBGA
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- JESD-30 Code :
- S-PBGA-B676
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 2.54mm
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 27mm
- Number of Inputs :
- 400
- Base Part Number :
- XC7A200T
- RoHS Status :
- Non-RoHS Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of Terminations :
- 676
- Radiation Hardening :
- No
- Number of Outputs :
- 400
- Number of LABs/CLBs :
- 16825
- Clock Frequency :
- 1286MHz
- Operating Temperature :
- 0°C~100°C TJ
- Power Supplies :
- 0.9V
- Datasheets
- XC7A200T-L2FBG676E
FPGAs AMD Xilinx XC7A200T-L2FBG676E Overview
The FPGAs AMD Xilinx XC7A200T-L2FBG676E is a highly capable integrated circuit from AMD Xilinx, designed for versatility across numerous applications requiring field programmability and high performance. This FPGA features a dense array of logic cells and robust I/O capabilities housed in a 676-pin flip-chip ball grid array (FCBGA) package. The IC is engineered to handle complex digital computations and signal processing tasks with remarkable efficiency and speed, making it an ideal choice for advanced technology solutions in demanding environments.
XC7A200T-L2FBG676E Features
The XC7A200T-L2FBG676E FPGA boasts an impressive array of features that make it a top contender in high-performance computing applications. Key features include its 400 I/O pins, which provide extensive interfacing capabilities. Additionally, its high logic cell count enables sophisticated custom logic implementations, while the FCBGA package ensures optimal thermal management and reduced footprint on the PCB.
XC7A200T-L2FBG676E Applications
- Data Centers: Utilized in server hardware to accelerate compute-intensive tasks such as data sorting and transaction processing, enhancing overall efficiency and performance.
- Telecommunications: Deployed in communication infrastructure to manage signal processing operations, contributing to improved data transfer rates and reliability in network systems.
- Automotive Systems: Integrated into driver assistance systems to perform real-time data processing, ensuring rapid response times and enhanced vehicular safety.
- Medical Equipment: Applied in medical imaging devices to facilitate complex image processing algorithms, helping in the production of clearer and more accurate diagnostic visuals.
- Aerospace and Defense: Used in satellite communications and radar systems, providing robust data processing capabilities that are crucial for mission-critical applications.
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