XC7A200T-3FBG676E
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- Mfr.Part #
- XC7A200T-3FBG676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 24,636
- In Stock ：
- 24,636
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 676
- Pbfree Code :
- yes
- JESD-30 Code :
- S-PBGA-B676
- JESD-609 Code :
- e1
- Pin Count :
- 676
- RAM Size :
- 1.6MB
- ECCN Code :
- 3A991.D
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Propagation Delay :
- 110 ps
- Number of Logic Elements/Cells :
- 215360
- Number of LABs/CLBs :
- 16825
- Packaging :
- Tray
- Height Seated (Max) :
- 2.54mm
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Power Supplies :
- 1V
- Number of Inputs :
- 400
- Width :
- 27mm
- Factory Lead Time :
- 10 Weeks
- Number of Outputs :
- 400
- Published :
- 2009
- Operating Temperature :
- 0°C~100°C TJ
- Operating Supply Voltage :
- 1V
- Supply Voltage :
- 1V
- Number of I/O :
- 400
- Package / Case :
- 676-BBGA, FCBGA
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 0.95V~1.05V
- Surface Mount :
- yes
- Clock Frequency :
- 1412MHz
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- XC7A200T
- Total RAM Bits :
- 13455360
- Speed Grade :
- -3
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.94 ns
- Terminal Position :
- BOTTOM
- Length :
- 27mm
- Radiation Hardening :
- No
- Number of Registers :
- 269200
- Series :
- Artix-7
- Datasheets
- XC7A200T-3FBG676E
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FPGAs AMD Xilinx XC7A200T-3FBG676E Overview
The FPGAs AMD Xilinx XC7A200T-3FBG676E is a highly capable field programmable gate array designed to meet the demanding requirements of modern digital circuits. This FPGA is engineered by AMD Xilinx, a leader in digital design and fabrication, ensuring top performance and reliability. With its 676-pin flip-chip ball grid array (FCBGA) packaging, it supports a vast array of I/O options, making it incredibly versatile for a wide range of applications. Its advanced features include substantial logic density increases, high signal processing capability, and low power consumption, making the XC7A200T-3FBG676E ideal for high-performance applications that require rapid prototyping and scalable integration.
XC7A200T-3FBG676E Features
This FPGA module is equipped with 400 I/O ports, providing ample connectivity for complex digital systems. It supports various logic configurations and can be programmed to handle a variety of digital computing tasks. The device is also characterized by its high-speed DSP slices, ample memory, and advanced security features, all of which contribute to its robustness in handling intensive applications.
XC7A200T-3FBG676E Applications
- Data Centers: Utilized in server farms and data centers for processing large volumes of data efficiently. The high I/O count and processing power make it suitable for data-intensive applications such as high-speed data processing and real-time analytics.
- Telecommunications: Employed in telecommunications infrastructure to manage signal processing tasks. Its capability to handle high-speed data transmission and conversion processes enhances the performance of telecommunications networks.
- Automotive: Used in advanced driver-assistance systems (ADAS) where rapid signal processing is crucial. The XC7A200T-3FBG676E's ability to perform multiple tasks simultaneously makes it an excellent choice for safety-critical automotive applications.
- Aerospace and Defense: Ideal for applications requiring high levels of data encryption and security, such as in satellite communications and military hardware. The FPGA's programmable nature allows for quick reconfiguration in the field, adapting to new technologies and standards.
- Consumer Electronics: Integrated into devices requiring complex user interfaces and multimedia handling, such as virtual reality systems and smart home devices. Its versatility supports innovation in consumer electronics by enabling more personalized and interactive user experiences.
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