XC7A200T-2FBG676I
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- Mfr.Part #
- XC7A200T-2FBG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pin Count :
- 676
- Power Supplies :
- 1V
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1V
- Total RAM Bits :
- 13455360
- Number of Logic Elements/Cells :
- 215360
- Terminal Form :
- Ball
- Series :
- Artix-7
- RAM Size :
- 1.6MB
- ECCN Code :
- 3A991.D
- Height Seated (Max) :
- 2.54mm
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Outputs :
- 400
- Number of Terminations :
- 676
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Number of Pins :
- 676
- Memory Size :
- 1GB
- Surface Mount :
- yes
- Factory Lead Time :
- 10 Weeks
- Speed Grade :
- -2
- Base Part Number :
- XC7A200T
- Memory Type :
- DDR3
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 400
- Pbfree Code :
- yes
- Length :
- 27mm
- Combinatorial Delay of a CLB-Max :
- 1.05 ns
- Clock Frequency :
- 1286MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 27mm
- Operating Temperature :
- -40°C~100°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 16825
- Number of Registers :
- 269200
- Mounting Type :
- Surface Mount
- Contact Plating :
- Copper, Silver, Tin
- Terminal Pitch :
- 1mm
- Package / Case :
- 676-BBGA, FCBGA
- Published :
- 2009
- Voltage - Supply :
- 0.95V~1.05V
- Datasheets
- XC7A200T-2FBG676I
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FPGAs AMD Xilinx XC7A200T-2FBG676I Overview
The FPGAs AMD Xilinx XC7A200T-2FBG676I is a highly capable field-programmable gate array designed to meet the rigorous demands of modern digital applications. Engineered by AMD Xilinx, this IC FPGA features 400 I/O on a 676-pin FCBGA (flip-chip ball grid array) package, providing a robust platform for complex, high-speed digital circuits. This component is optimal for designers looking to leverage superior programmability and performance in their hardware designs, while also ensuring scalability and flexibility in deployment. The XC7A200T-2FBG676I is tailored to support a wide range of applications, making it a versatile choice for industries aiming to innovate and improve their technological frameworks.
XC7A200T-2FBG676I Features
This FPGA unit from AMD Xilinx is packed with features that make it an essential tool for high-performance applications in computing and telecommunications. With a total of 400 I/O pins, it offers ample connectivity for complex designs requiring numerous inputs and outputs. The 676-pin FCBGA package ensures a reliable and durable connection to the motherboard, providing stable performance even under intense operational conditions. The XC7A200T-2FBG676I also supports advanced digital signal processing, making it suitable for applications requiring intensive computation and data manipulation.
XC7A200T-2FBG676I Applications
- Data Centers: Utilized in server architecture to enhance data processing capabilities and efficiency, adapting dynamically to workload demands.
- Telecommunications: Integrated into communication infrastructure for handling complex signal processing tasks and improving network reliability and throughput.
- Aerospace and Defense: Employed in avionics systems for flight control and navigation, ensuring robust performance in critical applications.
- Automotive: Used in driver assistance systems to process real-time data from sensors, enhancing vehicle safety and performance.
- Industrial Automation: Crucial for control systems in manufacturing processes, providing flexibility and precision in automation settings.
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