XC7A200T-1FBG676C
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- Mfr.Part #
- XC7A200T-1FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 495
- In Stock ：
- 495
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Voltage - Supply :
- 0.95V~1.05V
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 16825
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 215360
- Packaging :
- Tray
- JESD-30 Code :
- S-PBGA-B676
- Supply Voltage :
- 1V
- Height :
- 2.54mm
- Base Part Number :
- XC7A200T
- Terminal Form :
- Ball
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 400
- Surface Mount :
- yes
- Pin Count :
- 676
- Total RAM Bits :
- 13455360
- Number of Outputs :
- 400
- Speed Grade :
- -1
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1V
- ECCN Code :
- 3A991.D
- Length :
- 27mm
- Number of Inputs :
- 400
- Max Junction Temperature (Tj) :
- 85°C
- RoHS Status :
- ROHS3 Compliant
- JESD-609 Code :
- e1
- Factory Lead Time :
- 10 Weeks
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 676
- Combinatorial Delay of a CLB-Max :
- 1.27 ns
- Series :
- Artix-7
- Memory Type :
- DDR3
- Memory Size :
- 1GB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Clock Frequency :
- 1098MHz
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Published :
- 2009
- RAM Size :
- 1.6MB
- Number of Registers :
- 269200
- Width :
- 27mm
- Contact Plating :
- Copper, Silver, Tin
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Datasheets
- XC7A200T-1FBG676C
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FPGAs AMD Xilinx XC7A200T-1FBG676C Overview
The AMD Xilinx XC7A200T-1FBG676C represents a pinnacle in the FPGA (Field Programmable Gate Array) technology, meticulously engineered to meet the demanding needs of advanced digital circuit designs. This high-performance IC FPGA from AMD Xilinx is packaged in a 676-pin FCBGA (Flip Chip Ball Grid Array), designed to provide a robust platform for the development of complex applications with its 400 I/O capabilities. Ideal for high-throughput applications, this FPGA facilitates rapid prototyping and development, ensuring a reduction in time to market for products across various industries. The integration of state-of-the-art technology into the XC7A200T-1FBG676C enhances system performance, scalability, and power efficiency, making it a cornerstone for developers looking to push the boundaries of technological innovation.
XC7A200T-1FBG676C Features
This AMD Xilinx FPGA stands out with its extensive features designed for versatility and high performance in demanding environments. It includes a large number of logic cells, DSP slices for high-speed signal processing, and ample memory resources. Additionally, the device supports advanced clock management techniques and a wide range of IO standards, ensuring compatibility with current and future peripheral devices. Enhanced security features and power management options further underscore its suitability for sophisticated electronic designs.
XC7A200T-1FBG676C Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, the XC7A200T-1FBG676C enhances performance and efficiency in handling large-scale data operations.
- Telecommunications: Supports infrastructure for both wired and wireless communications, enabling enhanced signal processing capabilities critical for 5G deployment and network upgrades.
- Automotive: Integral in advanced driver-assistance systems (ADAS), providing the necessary computing power and flexibility to handle multiple sensors and real-time processing needs.
- Industrial Automation: Drives the development of robotics and control systems, offering adaptable programming and processing capabilities to manage diverse automation tasks effectively.
- Consumer Electronics: Used in the development of consumer devices, such as high-definition multimedia interfaces and virtual reality systems, where high-speed signal processing and connectivity are essential.
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