XC6VSX475T-2FFG1759E
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- Mfr.Part #
- XC6VSX475T-2FFG1759E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 840 I/O 1759FCBGA
- Stock
- 22,562
- In Stock ：
- 22,562
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1V
- Number of I/O :
- 840
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Qualification Status :
- Not Qualified
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Operating Temperature :
- 0°C~100°C TJ
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 3.5mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A001.A.7.A
- Number of Pins :
- 1759
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 1760-BBGA, FCBGA
- Published :
- 2008
- Combinatorial Delay of a CLB-Max :
- 0.67 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 1V
- Number of LABs/CLBs :
- 37200
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 0.95V~1.05V
- JESD-609 Code :
- e1
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 840
- Speed Grade :
- 2
- Base Part Number :
- XC6VSX475T
- Peak Reflow Temperature (Cel) :
- 245
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 4.7MB
- Series :
- Virtex®-6 SXT
- Terminal Form :
- Ball
- Mount :
- Surface Mount
- Total RAM Bits :
- 39223296
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 476160
- Datasheets
- XC6VSX475T-2FFG1759E
FPGAs AMD Xilinx XC6VSX475T-2FFG1759E Overview
The FPGAs AMD Xilinx XC6VSX475T-2FFG1759E is a high-performance field-programmable gate array designed to meet the demanding needs of modern digital circuits. This IC FPGA boasts an impressive array of 840 I/O options packaged in a compact 1759-pin flip-chip ball grid array (FCBGA). Engineered by AMD Xilinx, a leader in digital circuit technology, this FPGA is ideal for developers looking for a robust platform to handle complex designs with high-speed interfaces and extensive logic utilization. It offers a versatile solution that can be tailored to various applications, ensuring both scalability and adaptability in integration.
XC6VSX475T-2FFG1759E Features
The XC6VSX475T-2FFG1759E features a comprehensive set of capabilities suitable for high-throughput applications. These include advanced DSP slices for efficient data processing, high-speed transceivers for rapid data transfer, and ample logic cells to implement multifaceted logic designs. Its programmability allows engineers to update functionality without needing physical hardware changes, making it an excellent choice for systems that require long-term viability with evolving technology standards.
XC6VSX475T-2FFG1759E Applications
- Telecommunications: Utilized in networking equipment such as routers and switches, where its high I/O count and fast transceivers enable effective data management and signal processing.
- Data Centers: Applied in server infrastructure to accelerate data processing tasks, thereby enhancing data throughput and reducing latency in complex data-intensive applications.
- Medical Imaging: Used in the development of medical imaging systems like MRI and ultrasound machines, offering the necessary processing power to handle large data volumes and real-time image reconstruction.
- Aerospace and Defense: Serves in satellite communications and avionic systems, providing the robustness needed for critical mission-specific applications where reliability and precision are paramount.
- Industrial Automation: Implemented in control systems for automated production lines, improving operational efficiency and precision in high-speed manufacturing processes.
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