XC6VSX475T-2FFG1759C
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- Mfr.Part #
- XC6VSX475T-2FFG1759C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 840 I/O 1759FCBGA
- Stock
- 26,120
- In Stock ：
- 26,120
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- RAM Size :
- 4.7MB
- Base Part Number :
- XC6VSX475T
- Voltage - Supply :
- 0.95V~1.05V
- JESD-609 Code :
- e1
- Number of Pins :
- 1759
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Published :
- 2008
- RoHS Status :
- ROHS3 Compliant
- Speed Grade :
- 2
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 840
- Height Seated (Max) :
- 3.5mm
- Number of LABs/CLBs :
- 37200
- Mount :
- Surface Mount
- Package / Case :
- 1760-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 476160
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- ECCN Code :
- 3A001.A.7.A
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Operating Supply Voltage :
- 1V
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Factory Lead Time :
- 10 Weeks
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 39223296
- Number of I/O :
- 840
- Supply Voltage :
- 1V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 245
- Series :
- Virtex®-6 SXT
- Pbfree Code :
- yes
- Terminal Pitch :
- 1mm
- Datasheets
- XC6VSX475T-2FFG1759C
FPGAs AMD Xilinx XC6VSX475T-2FFG1759C Overview
The FPGAs AMD Xilinx XC6VSX475T-2FFG1759C represents a highly advanced field programmable gate array designed to meet the increasing demands of high-performance computing environments. Manufactured by AMD Xilinx, a leader in integrated circuits technology, this FPGA features a substantial 840 input/output options and is housed in a 1759-pin flip-chip ball grid array (FCBGA) package. Ideal for applications requiring high-speed data processing and flexibility, this product offers an unparalleled combination of performance, density, and scalability, making it a prime choice for developers and engineers seeking robust solutions for complex electronic designs.
XC6VSX475T-2FFG1759C Features
The XC6VSX475T-2FFG1759C FPGA from AMD Xilinx is equipped with 840 I/O interfaces, enabling extensive connectivity options and integration flexibility. The 1759FCBGA packaging not only ensures a compact footprint but also facilitates better thermal management and reliability under varying operational conditions. With its high configuration speeds and vast logic resources, this FPGA allows for rapid prototyping and quicker market deployment of high-tech applications.
XC6VSX475T-2FFG1759C Applications
- Telecommunications: Utilized in routers, switches, and base station equipment, this FPGA handles high-speed signal processing and data flow management, essential for modern telecommunications infrastructure.
- Data Centers: Supports server load balancing and data storage management, ensuring efficient data processing and throughput which is critical in large-scale data center operations.
- Medical Imaging: Plays a pivotal role in the processing and analysis of complex imaging data in medical diagnostic equipment, such as MRI and CT machines, enhancing image clarity and diagnostic accuracy.
- Aerospace and Defense: Ideal for applications in navigation systems, satellite communication, and avionics, where reliability and the ability to function in harsh environments are paramount.
- Automotive: Helps in advanced driver-assistance systems (ADAS), managing sensor inputs and real-time decision making, crucial for enhancing vehicle safety and autonomous functionalities.
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