XC6VSX475T-2FFG1156C
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- Mfr.Part #
- XC6VSX475T-2FFG1156C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1156FCBGA
- Stock
- 33,116
- In Stock ：
- 33,116
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 1156-BBGA, FCBGA
- Number of I/O :
- 600
- Terminal Pitch :
- 1mm
- Width :
- 35mm
- Operating Supply Voltage :
- 1V
- Peak Reflow Temperature (Cel) :
- 245
- Speed Grade :
- 2
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 39223296
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- Number of Pins :
- 1156
- Number of Outputs :
- 600
- ECCN Code :
- 3A991.D
- Length :
- 35mm
- Published :
- 2008
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 3.5mm
- Number of Logic Elements/Cells :
- 476160
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Supply Voltage :
- 1V
- Series :
- Virtex®-6 SXT
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- RAM Size :
- 4.7MB
- Mount :
- Surface Mount
- Base Part Number :
- XC6VSX475T
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Factory Lead Time :
- 10 Weeks
- Pbfree Code :
- yes
- Number of LABs/CLBs :
- 37200
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 0.95V~1.05V
- Datasheets
- XC6VSX475T-2FFG1156C
FPGAs AMD Xilinx XC6VSX475T-2FFG1156C Overview
The FPGAs AMD Xilinx XC6VSX475T-2FFG1156C is a highly advanced field-programmable gate array designed to meet the rigorous demands of modern digital applications. Manufactured by AMD Xilinx, this FPGA stands out for its impressive configuration, combining a robust 1156-pin flip-chip ball grid array (FCBGA) package with extensive I/O capabilities. Capable of supporting up to 600 I/Os, this product is engineered for versatility and high-performance levels in complex electronic environments. Its adaptability makes it an ideal choice for developers looking to harness significant computing power and flexibility in customizable logic solutions.
XC6VSX475T-2FFG1156C Features
This high-capacity FPGA offers several key features that make it suitable for a wide range of applications. The integration of a substantial number of I/O ports facilitates diverse connectivity options, enhancing its utility in multi-functional systems. The compact 1156FCBGA packaging ensures that it can fit into dense circuit board layouts without sacrificing performance, making it perfect for high-density electronic assemblies. Additionally, the chip's advanced technology is designed to optimize power efficiency, ensuring reliable performance even under strenuous operational conditions.
XC6VSX475T-2FFG1156C Applications
- Data Centers: Utilized in server farms and data processing hubs, this FPGA can handle complex algorithms for data management and security, ensuring efficient and secure data operations.
- Telecommunication Infrastructure: Integral to the development of telecommunication hardware, such as routers and switches, ensuring high-speed data transmission and network reliability.
- Automotive Technology: Deployed in advanced driver-assistance systems (ADAS) where high data throughput and processing capabilities are crucial for real-time decision making.
- Medical Imaging: Used in medical imaging devices like MRI and CT scanners, where the FPGA's ability to process large volumes of data in real-time enhances the clarity and detail of images.
- Industrial Automation: Essential in controlling machinery in automated production lines, improving precision and productivity through sophisticated control systems.
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