XC6VSX475T-2FF1759E
- Mfr.Part #
- XC6VSX475T-2FF1759E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 840 I/O 1759FCBGA
- Stock
- 8,231
- In Stock :
- 8,231
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Series :
- Virtex®-6 SXT
- Number of I/O :
- 840
- RoHS Status :
- Non-RoHS Compliant
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Supplier Device Package :
- 1759-FCBGA (42.5x42.5)
- Number of Logic Blocks (LABs) :
- 37200
- Base Part Number :
- XC6VSX475T
- Radiation Hardening :
- No
- Total RAM Bits :
- 39223296
- Max Operating Temperature :
- 100°C
- Number of LABs/CLBs :
- 37200
- Propagation Delay :
- 220 ps
- RAM Size :
- 4.7MB
- Mount :
- Surface Mount
- Operating Temperature :
- 0°C~100°C TJ
- Published :
- 2008
- Min Operating Temperature :
- 0°C
- Number of Logic Elements/Cells :
- 476160
- Speed Grade :
- 2
- Operating Supply Voltage :
- 1V
- Voltage - Supply :
- 0.95V~1.05V
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 1760-BBGA, FCBGA
- Datasheets
- XC6VSX475T-2FF1759E

FPGAs AMD Xilinx XC6VSX475T-2FF1759E Overview
The AMD Xilinx XC6VSX475T-2FF1759E, a high-performance field-programmable gate array (FPGA), is engineered to meet the demanding requirements of high-throughput applications. This FPGA from AMD Xilinx offers a robust platform for developing complex digital circuits with a flexible, programmable architecture that supports a wide range of applications. The XC6VSX475T-2FF1759E features an impressive array of 840 I/O pins housed in a 1759-pin flip-chip ball grid array (FCBGA) package, making it ideally suited for multi-layered, high-density circuit designs that require substantial connectivity and high-speed signal processing.
XC6VSX475T-2FF1759E Features
This FPGA is distinguished by its extensive I/O capabilities and high-speed data handling, accommodating extensive logic designs and data-intensive applications. It supports integrated DSP slices for advanced signal processing, high-speed GTP transceivers for rapid data transmission, and a large number of logic cells that allow for flexible and scalable hardware programming. The device's thermal and power management features ensure reliable performance in a variety of environmental conditions.
XC6VSX475T-2FF1759E Applications
- Telecommunications: Utilized in network infrastructure for packet processing, baseband processing in base stations, and other high-speed networking applications where high data throughput and extensive connectivity are essential.
- Data Centers: Deployed in servers and storage solutions to accelerate data processing tasks, manage large-scale data flows, and enhance cloud computing infrastructures with improved data handling and security features.
- Automotive: Integrated into driver assistance systems (ADAS), infotainment systems, and in-vehicle networking technologies, providing robust processing capabilities that support advanced automotive applications.
- Aerospace and Defense: Employed in satellite communications, avionic controls, and military hardware requiring high levels of data encryption and real-time processing in challenging environments.
- Industrial Automation: Used in machine control systems, industrial robotics, and complex sensor networks to improve efficiency and reliability of automated industrial processes.
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