XC6VSX475T-2FF1759E

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Mfr.Part #
XC6VSX475T-2FF1759E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 840 I/O 1759FCBGA
Stock
8,231
In Stock :
8,231

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
10 Weeks
Series :
Virtex®-6 SXT
Number of I/O :
840
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Packaging :
Tray
Supplier Device Package :
1759-FCBGA (42.5x42.5)
Number of Logic Blocks (LABs) :
37200
Base Part Number :
XC6VSX475T
Radiation Hardening :
No
Total RAM Bits :
39223296
Max Operating Temperature :
100°C
Number of LABs/CLBs :
37200
Propagation Delay :
220 ps
RAM Size :
4.7MB
Mount :
Surface Mount
Operating Temperature :
0°C~100°C TJ
Published :
2008
Min Operating Temperature :
0°C
Number of Logic Elements/Cells :
476160
Speed Grade :
2
Operating Supply Voltage :
1V
Voltage - Supply :
0.95V~1.05V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
1760-BBGA, FCBGA
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX475T-2FF1759E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC6VSX475T, Operating Temperature:0°C~100°C TJ, Package / Case:1760-BBGA, FCBGA, XC6VSX475T-2FF1759E pinout, XC6VSX475T-2FF1759E datasheet PDF, XC6VSX475T-2FF1759E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX475T-2FF1759E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX475T-2FF1759E


FPGAs AMD Xilinx XC6VSX475T-2FF1759E Overview

The AMD Xilinx XC6VSX475T-2FF1759E, a high-performance field-programmable gate array (FPGA), is engineered to meet the demanding requirements of high-throughput applications. This FPGA from AMD Xilinx offers a robust platform for developing complex digital circuits with a flexible, programmable architecture that supports a wide range of applications. The XC6VSX475T-2FF1759E features an impressive array of 840 I/O pins housed in a 1759-pin flip-chip ball grid array (FCBGA) package, making it ideally suited for multi-layered, high-density circuit designs that require substantial connectivity and high-speed signal processing.

XC6VSX475T-2FF1759E Features

This FPGA is distinguished by its extensive I/O capabilities and high-speed data handling, accommodating extensive logic designs and data-intensive applications. It supports integrated DSP slices for advanced signal processing, high-speed GTP transceivers for rapid data transmission, and a large number of logic cells that allow for flexible and scalable hardware programming. The device's thermal and power management features ensure reliable performance in a variety of environmental conditions.

XC6VSX475T-2FF1759E Applications

  • Telecommunications: Utilized in network infrastructure for packet processing, baseband processing in base stations, and other high-speed networking applications where high data throughput and extensive connectivity are essential.
  • Data Centers: Deployed in servers and storage solutions to accelerate data processing tasks, manage large-scale data flows, and enhance cloud computing infrastructures with improved data handling and security features.
  • Automotive: Integrated into driver assistance systems (ADAS), infotainment systems, and in-vehicle networking technologies, providing robust processing capabilities that support advanced automotive applications.
  • Aerospace and Defense: Employed in satellite communications, avionic controls, and military hardware requiring high levels of data encryption and real-time processing in challenging environments.
  • Industrial Automation: Used in machine control systems, industrial robotics, and complex sensor networks to improve efficiency and reliability of automated industrial processes.
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