XC6VSX475T-1FFG1759C

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Mfr.Part #
XC6VSX475T-1FFG1759C
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 840 I/O 1759FCBGA
Stock
3,640
In Stock :
3,640

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Supply Voltage :
1V
Mounting Type :
Surface Mount
Factory Lead Time :
10 Weeks
Length :
42.5mm
Number of Outputs :
840
Terminal Position :
BOTTOM
Reach Compliance Code :
not_compliant
Width :
42.5mm
Speed Grade :
1
RoHS Status :
ROHS3 Compliant
RAM Size :
4.7MB
Mount :
Surface Mount
Packaging :
Tray
Published :
2008
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
39223296
Height Seated (Max) :
3.5mm
Package / Case :
1760-BBGA, FCBGA
Voltage - Supply :
0.95V~1.05V
Qualification Status :
Not Qualified
Contact Plating :
Copper, Silver, Tin
Base Part Number :
XC6VSX475T
Pbfree Code :
yes
JESD-609 Code :
e1
Peak Reflow Temperature (Cel) :
245
Combinatorial Delay of a CLB-Max :
5.08 ns
Number of I/O :
840
Number of Pins :
1759
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®-6 SXT
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
476160
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of LABs/CLBs :
37200
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX475T-1FFG1759C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1760-BBGA, FCBGA, Base Part Number:XC6VSX475T, Number of Pins:1759, Operating Temperature:0°C~85°C TJ, XC6VSX475T-1FFG1759C pinout, XC6VSX475T-1FFG1759C datasheet PDF, XC6VSX475T-1FFG1759C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX475T-1FFG1759C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX475T-1FFG1759C


FPGAs AMD Xilinx XC6VSX475T-1FFG1759C Overview

The FPGAs AMD Xilinx XC6VSX475T-1FFG1759C is a high-performance, field-programmable gate array designed for advanced integrated circuit applications. This product offers a robust solution for developers requiring high-speed connectivity and extensive processing capabilities in a compact form factor. Manufactured by AMD Xilinx, a leader in FPGA technology, the XC6VSX475T-1FFG1759C supports a variety of digital and mixed-signal applications. Its design is optimized for efficiency, reducing power consumption while maximizing performance. The device's substantial I/O capability and flexible configuration options make it an excellent choice for designers aiming to accelerate time to market while achieving high-performance benchmarks.

XC6VSX475T-1FFG1759C Features

This FPGA model features 840 user I/Os and is housed in a 1759-pin flip-chip ball grid array (FCBGA) package. The device is characterized by its adaptability to various high-speed interfacing requirements and supports a wide range of logic density needs, making it suitable for complex digital computations and signal processing tasks. The versatility of the XC6VSX475T-1FFG1759C is further enhanced by its compatibility with multi-gigabit transceivers and advanced memory interfaces, providing ample opportunities for system integration and development.

XC6VSX475T-1FFG1759C Applications

  • Telecommunications: Utilized in networking hardware for data processing and signal integrity management, ensuring high-speed data transmission and effective communication handling.
  • Automotive Systems: Plays a crucial role in advanced driver-assistance systems (ADAS) by processing multiple real-time inputs from sensors and cameras, enhancing vehicle safety and functionality.
  • Consumer Electronics: Integral in the development of consumer electronics such as high-definition multimedia interfaces and virtual reality systems, providing the necessary processing power for high-quality user experiences.
  • Industrial Automation: Applied in control systems for real-time monitoring and automation processes, helping to increase the efficiency and reliability of industrial equipment.
  • Aerospace and Defense: Supports applications in navigation systems and satellite communications, offering robust performance in harsh environments and critical operations.
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