XC6VSX315T-3FFG1156C

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Mfr.Part #
XC6VSX315T-3FFG1156C
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1156FCBGA
Stock
1
In Stock :
1

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
1V
Number of LABs/CLBs :
24600
Number of I/O :
600
Series :
Virtex®-6 SXT
Terminal Position :
BOTTOM
Operating Supply Voltage :
1V
Qualification Status :
Not Qualified
Peak Reflow Temperature (Cel) :
245
Power Supplies :
11.2/2.5V
Published :
2008
Packaging :
Tray
Speed Grade :
3
Base Part Number :
XC6VSX315T
Total RAM Bits :
25952256
Number of Logic Elements/Cells :
314880
Terminal Pitch :
1mm
Reach Compliance Code :
not_compliant
Number of Outputs :
600
RAM Size :
3.1MB
Package / Case :
1156-BBGA, FCBGA
Mount :
Surface Mount
JESD-30 Code :
S-PBGA-B
Terminal Form :
Ball
Operating Temperature :
0°C~85°C TJ
Clock Frequency :
1412MHz
JESD-609 Code :
e1
Number of Pins :
1156
Factory Lead Time :
10 Weeks
Voltage - Supply :
0.95V~1.05V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-3FFG1156C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Base Part Number:XC6VSX315T, Package / Case:1156-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:1156, XC6VSX315T-3FFG1156C pinout, XC6VSX315T-3FFG1156C datasheet PDF, XC6VSX315T-3FFG1156C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-3FFG1156C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX315T-3FFG1156C


FPGAs AMD Xilinx XC6VSX315T-3FFG1156C Overview

The FPGAs AMD Xilinx XC6VSX315T-3FFG1156C represents a high-performance field-programmable gate array designed for applications requiring a high level of processing power and I/O capabilities. This particular model features a 1156-pin flip-chip ball grid array (FCBGA) packaging, making it ideal for dense and compact installations where space and heat are considerations. With its advanced design, it meets the needs of sophisticated digital signal processing and system integration. Its versatility makes it an essential choice for developers looking to push the limits of technology in various industrial sectors.

XC6VSX315T-3FFG1156C Features

The XC6VSX315T-3FFG1156C FPGA boasts an impressive array of features including support for up to 600 user I/Os, enabling extensive flexibility in interfacing with other systems and peripherals. The device supports advanced serial connectivity options, including high-speed transceivers for enhanced data transfer rates, essential for real-time applications. Furthermore, it includes integrated DSP slices for efficient processing of complex algorithms, making it highly suitable for computationally intensive tasks.

XC6VSX315T-3FFG1156C Applications

  • Telecommunications: Used in routing and switching solutions, the XC6VSX315T-3FFG1156C can manage multiple data streams efficiently, optimizing bandwidth and reducing latency in network infrastructures.
  • Automotive: Applicable in driver assistance systems, this FPGA processes real-time sensor data, helping to improve vehicle safety and performance.
  • Medical Imaging: Ideal for handling complex imaging algorithms, the FPGA supports advanced medical imaging equipment such as MRI and CT scanners, enhancing image clarity and processing speed.
  • Video Surveillance: In security and surveillance, it enables high-resolution video processing and analytics, crucial for modern security systems requiring facial recognition and motion detection.
  • Aerospace: The robust processing capabilities of the XC6VSX315T-3FFG1156C support avionics systems, including navigation and control systems that demand high reliability and precision.
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