XC6VSX315T-2FFG1156I
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- Mfr.Part #
- XC6VSX315T-2FFG1156I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1156FCBGA
- Stock
- 195
- In Stock ：
- 195
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 314880
- RAM Size :
- 3.1MB
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Number of I/O :
- 600
- Factory Lead Time :
- 10 Weeks
- Number of Outputs :
- 600
- Operating Supply Voltage :
- 1V
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Speed Grade :
- 2
- Length :
- 35mm
- Supply Voltage :
- 1V
- Mounting Type :
- Surface Mount
- Series :
- Virtex®-6 SXT
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of LABs/CLBs :
- 24600
- Package / Case :
- 1156-BBGA, FCBGA
- Pbfree Code :
- yes
- Peak Reflow Temperature (Cel) :
- 245
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 1156
- Operating Temperature :
- -40°C~100°C TJ
- Reach Compliance Code :
- not_compliant
- Base Part Number :
- XC6VSX315T
- Height Seated (Max) :
- 3.5mm
- Voltage - Supply :
- 0.95V~1.05V
- Width :
- 35mm
- Packaging :
- Tray
- Mount :
- Surface Mount
- Published :
- 2008
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 25952256
- Datasheets
- XC6VSX315T-2FFG1156I
FPGAs AMD Xilinx XC6VSX315T-2FFG1156I Overview
Introducing the FPGAs AMD Xilinx XC6VSX315T-2FFG1156I, a highly capable FPGA from AMD Xilinx, designed to meet the demanding needs of modern digital applications. This device offers a robust blend of performance and flexibility with its 600 I/O pins housed in a 1156FCBGA package, making it an ideal choice for developers looking to push the boundaries of hardware acceleration and complex digital processing. Tailored for high-performance applications, this FPGA is equipped to handle extensive data processing tasks while providing scalability and reliability for industrial-grade projects.
XC6VSX315T-2FFG1156I Features
The XC6VSX315T-2FFG1156I from AMD Xilinx stands out with its extensive set of features, including a high I/O pin count, which is essential for complex, multi-layered designs. The FPGA is housed in a 1156-pin flip-chip ball grid array (FCBGA) package that ensures robust physical connectivity and excellent thermal management. Enhanced with high-speed DSP slices, this device supports advanced digital signal processing, making it suitable for audio, video, and signal conditioning applications.
XC6VSX315T-2FFG1156I Applications
- Telecommunications: This FPGA excels in managing and processing high-speed data streams, making it ideal for infrastructure in networks and communication systems.
- Data Centers: Capable of handling complex algorithms required for data processing and storage management, this FPGA enhances efficiency and reliability in server operations.
- Aerospace and Defense: The robust design and high reliability of the XC6VSX315T-2FFG1156I make it suitable for applications in aerospace and defense electronics, where precision and durability are paramount.
- Medical Imaging: With its ability to perform high-speed DSP operations, this FPGA can be used in medical imaging systems, supporting advanced imaging techniques and real-time processing.
- Automotive: Suitable for automotive applications, particularly in advanced driver-assistance systems (ADAS), where real-time signal processing is critical for vehicle safety and navigation systems.
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