XC6VSX315T-2FF1759C
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- Mfr.Part #
- XC6VSX315T-2FF1759C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 720 I/O 1759FCBGA
- Stock
- 39,442
- In Stock ：
- 39,442
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A001.A.7.A
- Total RAM Bits :
- 25952256
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Series :
- Virtex®-6 SXT
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 314880
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 1759
- Pin Count :
- 1759
- Number of LABs/CLBs :
- 24600
- Speed Grade :
- 2
- Number of Outputs :
- 720
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Reach Compliance Code :
- not_compliant
- JESD-30 Code :
- S-PBGA-B1759
- Supply Voltage :
- 1V
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Package / Case :
- 1760-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Factory Lead Time :
- 10 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Mount :
- Surface Mount
- Height Seated (Max) :
- 3.5mm
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Number of Inputs :
- 720
- Number of I/O :
- 720
- Qualification Status :
- Not Qualified
- Contact Plating :
- Lead, Tin
- Voltage - Supply :
- 0.95V~1.05V
- Published :
- 2008
- RAM Size :
- 3.1MB
- Base Part Number :
- XC6VSX315T
- Terminal Form :
- Ball
- Datasheets
- XC6VSX315T-2FF1759C
FPGAs AMD Xilinx XC6VSX315T-2FF1759C Overview
The FPGAs AMD Xilinx XC6VSX315T-2FF1759C is a high-performance Field Programmable Gate Array designed for advanced systems requiring high-speed data processing and significant I/O capabilities. Manufactured by AMD Xilinx, this FPGA is encapsulated in a 1759-pin FCBGA package and supports a broad range of applications from high-end communications infrastructure to sophisticated defense systems. With its ability to handle complex digital computations while providing flexibility in hardware configuration, the XC6VSX315T-2FF1759C stands out as a versatile component for technology innovators looking to push the boundaries of modern electronics.
XC6VSX315T-2FF1759C Features
The XC6VSX315T-2FF1759C FPGA is packed with features designed for robust performance and adaptability. It boasts 720 I/O pins, allowing for extensive connectivity options. The device's high-speed transceiver lines enable rapid data transfer, essential for applications in high-speed networking and telecommunications. Moreover, its compatibility with multi-gigabit protocols and advanced memory interfacing options ensure that it can meet the demands of data-intensive applications.
XC6VSX315T-2FF1759C Applications
- Telecommunications: Utilized in routing and switching solutions, this FPGA processes high volumes of data traffic efficiently, ensuring minimal latency and increased bandwidth management in complex networks.
- Data Centers: Acts as the backbone for high-speed server applications, facilitating rapid data processing and storage solutions that require high throughput and real-time data access.
- Aerospace and Defense: Employed in avionics and military communication systems, where robustness and reliability are critical. The FPGA's programmability allows for quick reconfiguration of systems to meet diverse and mission-critical tasks.
- Medical Imaging: Integral in advanced medical imaging technologies such as MRI and CT scanners, helping to process complex algorithms required for high-resolution image processing and diagnostics.
- Automotive: Supports driver assistance systems and infotainment systems by processing multiple inputs and outputs simultaneously, ensuring seamless integration and functionality within modern vehicles.
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