XC6VSX315T-2FF1156I

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Mfr.Part #
XC6VSX315T-2FF1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1156FCBGA
Stock
44,158
In Stock :
44,158

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2003
Terminal Pitch :
1mm
Factory Lead Time :
10 Weeks
Length :
35mm
Number of Pins :
1156
Terminal Position :
BOTTOM
Speed Grade :
2
Package / Case :
1156-BBGA, FCBGA
Total RAM Bits :
25952256
Pbfree Code :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
0.95V~1.05V
Number of LABs/CLBs :
24600
Mounting Type :
Surface Mount
Operating Supply Voltage :
1V
Reach Compliance Code :
not_compliant
Series :
Virtex®-6 SXT
Mount :
Surface Mount
Packaging :
Tray
Number of Logic Elements/Cells :
314880
RoHS Status :
Non-RoHS Compliant
Width :
35mm
Supply Voltage :
1V
Base Part Number :
XC6VSX315T
Terminal Finish :
Tin/Lead (Sn63Pb37)
Operating Temperature :
-40°C~100°C TJ
Height Seated (Max) :
3.5mm
Terminal Form :
Ball
RAM Size :
3.1MB
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Qualification Status :
Not Qualified
ECCN Code :
3A991.D
Number of Outputs :
600
Number of I/O :
600
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1156I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1156, Package / Case:1156-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC6VSX315T, Operating Temperature:-40°C~100°C TJ, XC6VSX315T-2FF1156I pinout, XC6VSX315T-2FF1156I datasheet PDF, XC6VSX315T-2FF1156I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1156I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX315T-2FF1156I


FPGAs AMD Xilinx XC6VSX315T-2FF1156I Overview

The FPGAs AMD Xilinx XC6VSX315T-2FF1156I represents a high-performance field-programmable gate array designed for advanced integrated circuit applications. This robust FPGA module is housed in a 1156-pin flip-chip ball grid array (FCBGA) package, offering a versatile solution for developers requiring substantial I/O capabilities and high-speed digital processing. The XC6VSX315T-2FF1156I is built to meet the rigorous demands of high-throughput systems, making it an ideal choice for industries looking to leverage the speed and flexibility of AMD Xilinx's FPGA technology for their critical applications.

XC6VSX315T-2FF1156I Features

This FPGA features 600 user I/O pins, providing ample flexibility for various design needs. The XC6VSX315T-2FF1156I is optimized for high-speed data processing and energy efficiency, supporting a range of programmable logic operations that are crucial for complex digital computations. Its advanced architecture enables significant customization, allowing developers to tailor the FPGA to specific product requirements and challenges.

XC6VSX315T-2FF1156I Applications

  • Data Centers: Used in server farms and cloud storage facilities to accelerate data processing and network traffic management, enhancing overall efficiency and performance.
  • Telecommunications: Integral for developing base station infrastructure, supporting high-speed communication protocols and optimizing signal processing tasks.
  • Automotive: Critical in driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems, improving safety and user experience through rapid data handling and response times.
  • Video Processing: Deployed in advanced video surveillance systems and high-definition video streaming services, providing the necessary processing power to handle multiple video streams in real time.
  • Aerospace and Defense: Utilized in satellite communications and military radar systems, offering robustness and reliability for mission-critical applications in harsh environments.
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