XC6VSX315T-2FF1156C

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Mfr.Part #
XC6VSX315T-2FF1156C
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1156FCBGA
Stock
38,284
In Stock :
38,284

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
24600
Propagation Delay :
220 ps
Series :
Virtex®-6 SXT
Total RAM Bits :
25952256
Terminal Position :
BOTTOM
Height Seated (Max) :
3.5mm
Number of Outputs :
600
Number of Logic Elements/Cells :
314880
Mount :
Surface Mount
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B1156
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Base Part Number :
XC6VSX315T
Factory Lead Time :
10 Weeks
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
Pbfree Code :
No
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
JESD-609 Code :
e0
Operating Supply Voltage :
1V
Published :
2008
Number of Inputs :
600
Length :
35mm
Supply Voltage :
1V
ECCN Code :
3A991.D
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
0.95V~1.05V
Qualification Status :
Not Qualified
Speed Grade :
2
Reach Compliance Code :
not_compliant
Packaging :
Tray
Package / Case :
1156-BBGA, FCBGA
Number of I/O :
600
Terminal Finish :
Tin/Lead (Sn63Pb37)
Width :
35mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
3.1MB
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1156C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC6VSX315T, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:1156-BBGA, FCBGA, XC6VSX315T-2FF1156C pinout, XC6VSX315T-2FF1156C datasheet PDF, XC6VSX315T-2FF1156C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VSX315T-2FF1156C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VSX315T-2FF1156C


FPGAs AMD Xilinx XC6VSX315T-2FF1156C Overview

The FPGAs AMD Xilinx XC6VSX315T-2FF1156C represents a powerful field programmable gate array designed for high-performance applications requiring a significant amount of I/Os and high-speed data processing capabilities. Manufactured by AMD Xilinx, this FPGA is engineered to deliver superior efficiency and adaptability with its advanced 1156-pin flip-chip ball grid array (FCBGA) package, making it a reliable choice for developers looking to push the boundaries of digital circuit design. The flexibility offered by this device allows for rapid prototyping and customization in complex projects, securing its role as a cornerstone in contemporary electronics development.

XC6VSX315T-2FF1156C Features

This FPGA features a robust array of functionalities that set it apart in the realm of digital circuit design. Key attributes include its 600 user-programmable I/Os which provide extensive interface capabilities, supporting a wide range of peripherals and high-speed data transfer protocols. Additionally, the device's scalable architecture ensures that it can meet varying system requirements, making it suitable for both large-scale and precision-focused applications.

XC6VSX315T-2FF1156C Applications

  • Telecommunications: Utilized in networking hardware such as routers and switches, the XC6VSX315T-2FF1156C enhances data processing speeds and connectivity options, allowing for efficient and reliable communication infrastructures.
  • Data Centers: Employs its high I/O capacity and processing power to manage complex computations and data storage operations, contributing to the robust infrastructure required for modern data centers.
  • Automotive: Integral in advanced driver-assistance systems (ADAS), this FPGA processes multiple inputs from automotive sensors, improving vehicle safety and performance through faster response times and decision-making processes.
  • Industrial Automation: Enhances control systems in industrial environments by offering programmable logic solutions that adapt to varied machinery and process requirements, thereby improving operational efficiency and reliability.
  • Aerospace: Deployed in avionics and satellite systems, where its ability to handle extreme environmental conditions and perform multiple, complex tasks simultaneously is critical.
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