XC6VLX760-2FFG1760C

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Mfr.Part #
XC6VLX760-2FFG1760C
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1200 I/O 1760FCBGA
Stock
32,574
In Stock :
32,574

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Supply Voltage :
1V
Number of Pins :
1760
Factory Lead Time :
10 Weeks
Terminal Position :
BOTTOM
Contact Plating :
Copper, Silver, Tin
Number of I/O :
1200
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
3A001.A.7.A
Package / Case :
1760-BBGA, FCBGA
Peak Reflow Temperature (Cel) :
245
Pbfree Code :
yes
Mounting Type :
Surface Mount
Base Part Number :
XC6VLX760
Series :
Virtex®-6 LXT
RoHS Status :
ROHS3 Compliant
Terminal Form :
Ball
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Operating Temperature :
0°C~85°C TJ
JESD-609 Code :
e1
Height Seated (Max) :
3.5mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
2
Published :
2008
Total RAM Bits :
26542080
Voltage - Supply :
0.95V~1.05V
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
3.2MB
Qualification Status :
Not Qualified
Number of Logic Elements/Cells :
758784
Packaging :
Tray
Terminal Pitch :
1mm
Number of LABs/CLBs :
59280
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VLX760-2FFG1760C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1760, Package / Case:1760-BBGA, FCBGA, Mounting Type:Surface Mount, Base Part Number:XC6VLX760, Operating Temperature:0°C~85°C TJ, XC6VLX760-2FFG1760C pinout, XC6VLX760-2FFG1760C datasheet PDF, XC6VLX760-2FFG1760C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VLX760-2FFG1760C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VLX760-2FFG1760C


FPGAs AMD Xilinx XC6VLX760-2FFG1760C Overview

The FPGAs AMD Xilinx XC6VLX760-2FFG1760C is a highly capable field-programmable gate array designed to meet the demanding needs of modern digital circuits. Manufactured by AMD Xilinx, this IC FPGA features a robust 1760-pin flip-chip ball grid array (FCBGA) packaging, ensuring a reliable connection and superior performance in a variety of applications. With a focus on delivering high-speed and high-density logic operations, the XC6VLX760-2FFG1760C excels in complex algorithm processing, making it an ideal choice for industries looking to harness the power of programmable logic devices.

XC6VLX760-2FFG1760C Features

This FPGA model boasts 1200 user I/Os, providing ample flexibility for interfacing with a wide range of peripheral devices. Its advanced architecture supports extensive logic element utilization and integration, facilitating sophisticated design implementations and optimizations. This product is a cornerstone in applications requiring rapid prototyping and development due to its configurable logic blocks and high interconnect throughput.

XC6VLX760-2FFG1760C Applications

  • Telecommunications Equipment: The XC6VLX760-2FFG1760C is pivotal in developing high-speed network devices like routers and switches, enhancing data flow and connectivity.
  • Automotive Systems: Utilized in driver assistance systems, this FPGA helps to process real-time data from sensors and cameras, crucial for safety and navigation enhancements.
  • Medical Devices: In medical imaging systems, the XC6VLX760-2FFG1760C aids in the processing of complex imaging algorithms, contributing to clearer and more precise diagnostics.
  • Industrial Automation: This FPGA streamlines operations in automated machinery by executing control functions and real-time processing, improving efficiency and reliability in manufacturing processes.
  • Consumer Electronics: Used in devices such as high-definition televisions and gaming consoles, the XC6VLX760-2FFG1760C enhances graphic processing and user interface responsiveness.
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