XC6VLX760-1FF1760C

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Mfr.Part #
XC6VLX760-1FF1760C
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1200 I/O 1760FCBGA
Stock
35,163
In Stock :
35,163

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.95V~1.05V
RoHS Status :
Non-RoHS Compliant
Published :
2008
Min Operating Temperature :
0°C
Operating Temperature :
0°C~85°C TJ
Max Operating Temperature :
85°C
Mount :
Surface Mount
Total RAM Bits :
26542080
Number of I/O :
1200
Number of LABs/CLBs :
59280
Factory Lead Time :
10 Weeks
Operating Supply Voltage :
1V
Supplier Device Package :
1760-FCBGA (42.5x42.5)
Package / Case :
1760-BBGA, FCBGA
Packaging :
Tray
Base Part Number :
XC6VLX760
Series :
Virtex®-6 LXT
Speed Grade :
1
Mounting Type :
Surface Mount
RAM Size :
3.2MB
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Logic Blocks (LABs) :
59280
Number of Logic Elements/Cells :
758784
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VLX760-1FF1760C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:1760-BBGA, FCBGA, Base Part Number:XC6VLX760, Mounting Type:Surface Mount, XC6VLX760-1FF1760C pinout, XC6VLX760-1FF1760C datasheet PDF, XC6VLX760-1FF1760C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VLX760-1FF1760C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VLX760-1FF1760C


FPGAs AMD Xilinx XC6VLX760-1FF1760C Overview

Introducing the FPGAs AMD Xilinx XC6VLX760-1FF1760C, a highly capable field programmable gate array (FPGA) designed to meet the intensive demands of high-throughput, high-density applications. Engineered by AMD Xilinx, a leader in digital design technologies, this FPGA stands out with its expansive integration features including 1200 I/O options and a robust 1760FCBGA package. This product is tailored to support complex digital processing tasks which require superior speed and flexibility. Whether deploying for industrial, communications, or advanced scientific research, the XC6VLX760-1FF1760C provides the reliability and performance necessary for critical high-tech solutions.

XC6VLX760-1FF1760C Features

The XC6VLX760-1FF1760C FPGA boasts a comprehensive suite of features that enhance its utility and performance in various applications. Key features include its large-scale integration capabilities, support for high-speed signal processing, and a flexible 1760-pin flip-chip ball grid array (FCBGA) packaging that ensures a reliable electrical connection and efficient heat dissipation. This FPGA is designed to deliver high performance while maintaining low power consumption, making it an ideal choice for environmentally conscious deployment scenarios.

XC6VLX760-1FF1760C Applications

  • Telecommunications Infrastructure: The XC6VLX760-1FF1760C can be applied in routers and switches, enhancing signal processing capabilities to handle vast amounts of data transmission efficiently.
  • Automotive Systems: Utilized in advanced driver-assistance systems (ADAS), this FPGA processes multiple real-time inputs from sensors, providing crucial data for immediate decisions in dynamic driving environments.
  • Data Centers: Ideal for use in data storage systems, offering rapid data access and processing power to manage large-scale data operations and cloud computing services.
  • Medical Imaging: In medical diagnostic equipment, such as MRI and ultrasound machines, the FPGA processes complex imaging data, ensuring high-resolution outputs for accurate diagnostics.
  • Aerospace and Defense: Deployed in navigation systems and onboard computers, it supports critical operations with high reliability and robust performance under extreme conditions.
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