XC6VLX75T-2FFG784C
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- Mfr.Part #
- XC6VLX75T-2FFG784C
- Manufacturer
- AMD Xilinx
- Package / Case
- 784-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 784FCBGA
- Stock
- 514
- In Stock ：
- 514
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supplier Device Package :
- 784-FCBGA (29x29)
- Base Part Number :
- XC6VLX75T
- Number of LABs/CLBs :
- 5820
- Package / Case :
- 784-BBGA, FCBGA
- Number of I/O :
- 360
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 5750784
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Max Operating Temperature :
- 85°C
- Number of Logic Elements/Cells :
- 74496
- Number of Logic Blocks (LABs) :
- 5820
- Min Operating Temperature :
- 0°C
- Series :
- Virtex®-6 LXT
- RAM Size :
- 702kB
- Speed Grade :
- 2
- Factory Lead Time :
- 10 Weeks
- Mount :
- Surface Mount
- Voltage - Supply :
- 0.95V~1.05V
- Published :
- 2002
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1V
- Datasheets
- XC6VLX75T-2FFG784C
FPGAs AMD Xilinx XC6VLX75T-2FFG784C Overview
The FPGAs AMD Xilinx XC6VLX75T-2FFG784C is a high-performance, field-programmable gate array designed for advanced integrated circuit applications. Manufactured by AMD Xilinx, this FPGA stands out with its robust 784-pin flip-chip ball grid array (FCBGA) packaging, enabling substantial I/O throughput with 360 available I/O pins. Ideal for designers aiming for rapid prototyping and complex digital circuit development, this FPGA is versatile in handling multiple and diverse high-speed signal processing tasks, making it a top choice in a variety of sectors.
XC6VLX75T-2FFG784C Features
The XC6VLX75T-2FFG784C FPGA is designed to meet the demanding needs of modern electronics applications. It features a flexible logic architecture, extensive memory integration, and high-speed DSP processing capability. Additionally, the FPGA supports various high-speed serial connectivity standards, which are essential for system scalability and improved data throughput. The thermal and power management of this device is engineered to maintain high performance without compromising system reliability.
XC6VLX75T-2FFG784C Applications
- Telecommunications: Utilized in networking equipment such as switches and routers for packet processing and data flow management, enhancing overall network efficiency and speed.
- Aerospace and Defense: Applied in avionics for signal and image processing, communication systems, and surveillance equipment, providing robust, error-free data handling in critical missions.
- Medical Imaging: Integrated into medical devices for high-resolution imaging techniques, such as MRI and CT scanners, ensuring precise image data processing for accurate diagnostics.
- Automotive: Used in driver assistance systems (ADAS), where real-time sensor data processing is crucial for vehicle safety and navigation enhancements.
- Industrial Automation: Employs in control systems for real-time processing of sensor data and machine control, leading to increased productivity and system efficiency.
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