XC6VLX550T-2FF1760C
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- Mfr.Part #
- XC6VLX550T-2FF1760C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 1200 I/O 1760FCBGA
- Stock
- 47,764
- In Stock ：
- 47,764
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Contact Plating :
- Lead, Tin
- JESD-30 Code :
- S-PBGA-B1760
- Number of I/O :
- 1200
- Reach Compliance Code :
- not_compliant
- Total RAM Bits :
- 23298048
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 42960
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 3.5mm
- JESD-609 Code :
- e0
- ECCN Code :
- 3A001.A.7.A
- Series :
- Virtex®-6 LXT
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 0.95V~1.05V
- RAM Size :
- 2.8MB
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- XC6VLX550T
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- Non-RoHS Compliant
- Pbfree Code :
- No
- Speed Grade :
- 2
- Mount :
- Surface Mount
- Package / Case :
- 1760-BBGA, FCBGA
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Published :
- 2008
- Peak Reflow Temperature (Cel) :
- 225
- Qualification Status :
- Not Qualified
- Number of Logic Elements/Cells :
- 549888
- Terminal Form :
- Ball
- Supply Voltage :
- 1V
- Datasheets
- XC6VLX550T-2FF1760C
FPGAs AMD Xilinx XC6VLX550T-2FF1760C Overview
The FPGAs AMD Xilinx XC6VLX550T-2FF1760C is a high-performance, field-programmable gate array designed to meet the demanding needs of modern digital circuits. Manufactured by AMD Xilinx, this IC FPGA boasts an impressive array of 1200 I/O pins encapsulated in a 1760FCBGA package, allowing for a wide range of connectivity options and superior flexibility in system design. This product is ideal for developers looking to push the boundaries of hardware acceleration, data processing, and system integration, providing a robust platform for innovation and complex applications in industrial environments.
XC6VLX550T-2FF1760C Features
The XC6VLX550T-2FF1760C includes several features that set it apart in the field of programmable logic solutions. It supports a high I/O pin count, essential for complex designs requiring numerous connections and interfaces. The 1760FCBGA package ensures high-density integration and reliability, crucial for applications in space-constrained settings. Additionally, the FPGA's architecture allows for scalable configurations, making it suitable for both prototyping and full-scale production deployments.
XC6VLX550T-2FF1760C Applications
- Telecommunications Equipment: Utilized in routers, switches, and base stations, where its high I/O count and flexibility facilitate fast data processing and throughput.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) for processing and integrating multiple sensor inputs, enhancing vehicle safety and performance.
- Medical Imaging: Used in devices such as MRI and ultrasound machines, offering the necessary processing power for real-time, high-resolution image processing.
- Industrial Automation: Key component in PLCs and robotic controllers, where adaptability and processing capabilities enable sophisticated control and monitoring systems.
- Data Centers: Helps manage and accelerate workloads in storage controllers and network management systems, improving efficiency and reducing latency.
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