XC6VLX130T-2FFG784C
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- Mfr.Part #
- XC6VLX130T-2FFG784C
- Manufacturer
- AMD Xilinx
- Package / Case
- 784-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 784FCBGA
- Stock
- 1,246
- In Stock ：
- 1,246
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 128000
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Virtex®-6 LXT
- Number of Pins :
- 784
- Published :
- 2002
- Peak Reflow Temperature (Cel) :
- 245
- Mount :
- Surface Mount
- Supply Voltage :
- 1V
- Speed Grade :
- 2
- Factory Lead Time :
- 10 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- XC6VLX130T
- Pin Count :
- 784
- Number of Terminations :
- 784
- Number of I/O :
- 400
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1V
- Height Seated (Max) :
- 3.1mm
- Package / Case :
- 784-BBGA, FCBGA
- RAM Size :
- 1.2MB
- Total RAM Bits :
- 9732096
- Voltage - Supply :
- 0.95V~1.05V
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Pbfree Code :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Number of LABs/CLBs :
- 10000
- ECCN Code :
- 3A991.D
- Number of Outputs :
- 400
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XC6VLX130T-2FFG784C
FPGAs AMD Xilinx XC6VLX130T-2FFG784C Overview
The FPGAs AMD Xilinx XC6VLX130T-2FFG784C is a highly capable integrated circuit designed by AMD Xilinx to meet the demanding needs of modern digital systems. This FPGA (Field Programmable Gate Array) excels in environments where versatility and high-performance are paramount. Featuring a robust 784-pin flip-chip ball grid array (FCBGA) package, it supports numerous I/O options and complex digital signal processing. The XC6VLX130T-2FFG784C is optimized for applications that require intensive data processing and high-speed interfacing, making it an ideal choice for industries aiming to enhance their digital infrastructure.
XC6VLX130T-2FFG784C Features
The XC6VLX130T-2FFG784C FPGA is equipped with 400 I/O pins, providing extensive connectivity and flexibility in system design. This module supports a dual-range voltage operation, allowing it to work efficiently in varied electronic environments. It is known for its high-speed performance and ability to handle complex algorithms, which is facilitated by its advanced architecture and the scalability offered by AMD Xilinx's design software.
XC6VLX130T-2FFG784C Applications
- Data Centers: Utilized for managing high-speed data operations and server load balancing, improving efficiency and data throughput.
- Telecommunications: Supports high-speed signal processing tasks necessary for base station development and network infrastructure, enhancing communication reliability and bandwidth.
- Aerospace: Employs in avionics for real-time system monitoring and control, ensuring robust and reliable aerospace technology performance.
- Automotive: Integrated into driver assistance systems to process real-time sensor data, contributing to safer driving experiences and advanced vehicle functionalities.
- Medical Imaging: Applied in medical devices for processing complex imaging algorithms required in diagnostic equipment like MRI and CT scanners, ensuring high-resolution images for accurate diagnostics.
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