XC6VHX250T-3FFG1154C

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Mfr.Part #
XC6VHX250T-3FFG1154C
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 320 I/O 1156FCBGA
Stock
6
In Stock :
6

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
245
Speed Grade :
3
Clock Frequency :
1412MHz
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
320
Terminal Form :
Ball
Base Part Number :
XC6VHX250T
Power Supplies :
11.2/2.5V
Factory Lead Time :
10 Weeks
Operating Supply Voltage :
1V
Number of Pins :
1154
Mounting Type :
Surface Mount
Published :
2008
Operating Temperature :
0°C~85°C TJ
Series :
Virtex®-6 HXT
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of LABs/CLBs :
19680
Number of Outputs :
320
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
251904
Total RAM Bits :
18579456
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Voltage - Supply :
0.95V~1.05V
RAM Size :
2.2MB
Packaging :
Tray
Qualification Status :
Not Qualified
Package / Case :
1156-BBGA, FCBGA
JESD-609 Code :
e1
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VHX250T-3FFG1154C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC6VHX250T, Number of Pins:1154, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:1156-BBGA, FCBGA, XC6VHX250T-3FFG1154C pinout, XC6VHX250T-3FFG1154C datasheet PDF, XC6VHX250T-3FFG1154C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC6VHX250T-3FFG1154C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC6VHX250T-3FFG1154C


FPGAs AMD Xilinx XC6VHX250T-3FFG1154C Overview

The AMD Xilinx XC6VHX250T-3FFG1154C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of advanced digital processing. This FPGA is ideal for developers looking for a robust platform to deploy complex designs needing substantial logic, high-speed serial connectivity, and ample input/output options. It facilitates accelerated development cycles with its reconfigurable technology, making it a prime choice for industries aiming to achieve rapid prototyping and scalable solutions. The integration of 320 I/O pins in a compact 1156FCBGA package allows for versatile hardware interfacing, making it a powerful core component for a wide array of applications.

XC6VHX250T-3FFG1154C Features

This FPGA module stands out with its extensive features designed for efficiency and performance scalability. Key features include a large array of configurable logic blocks, advanced DSP slices for high-speed computations, and high-speed transceivers for excellent data throughput. Additionally, its compatibility with multi-gigabit serial I/O standards and its capacity to support various memory types are pivotal for applications requiring high data bandwidth and storage flexibility.

XC6VHX250T-3FFG1154C Applications

  • Data Centers: Utilized for managing intense computation and data processing tasks efficiently, ensuring quicker data access and real-time processing capabilities.
  • Telecommunications: Acts as a critical component in communication infrastructure, enabling robust signal processing functionalities and supporting multiple communication standards.
  • Automotive: Integrated into driver assistance systems, providing the necessary processing power for sensor data integration and real-time decision-making in autonomous and semi-autonomous vehicles.
  • Video Processing: Essential for high-resolution video encoding/decoding and real-time image processing applications, improving multimedia delivery and display technologies.
  • Industrial Automation: Drives the automation process with its ability to handle complex control systems and machinery operations, enhancing productivity and operational efficiency.
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