XC5VSX50T-2FF665C

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Mfr.Part #
XC5VSX50T-2FF665C
Manufacturer
AMD Xilinx
Package / Case
665-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 665FCBGA
Stock
5,889
In Stock :
5,889

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Pins :
665
Terminal Pitch :
1mm
Factory Lead Time :
11 Weeks
Packaging :
Tray
Peak Reflow Temperature (Cel) :
225
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e0
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Number of I/O :
360
Speed Grade :
2
Number of Outputs :
360
Reach Compliance Code :
not_compliant
Published :
1999
Base Part Number :
XC5VSX50T
RAM Size :
594kB
Total RAM Bits :
4866048
Terminal Position :
BOTTOM
Pbfree Code :
No
Number of Terminations :
665
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
ECCN Code :
3A991.D
Number of Logic Elements/Cells :
52224
Operating Supply Voltage :
1V
Package / Case :
665-BBGA, FCBGA
Series :
Virtex®-5 SXT
Terminal Finish :
Tin/Lead (Sn63Pb37)
Supply Voltage :
1V
Qualification Status :
Not Qualified
Number of LABs/CLBs :
4080
Pin Count :
665
Voltage - Supply :
0.95V~1.05V
Datasheets
XC5VSX50T-2FF665C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-2FF665C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:665, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:XC5VSX50T, Number of Terminations:665, Package / Case:665-BBGA, FCBGA, XC5VSX50T-2FF665C pinout, XC5VSX50T-2FF665C datasheet PDF, XC5VSX50T-2FF665C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-2FF665C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VSX50T-2FF665C


FPGAs AMD Xilinx XC5VSX50T-2FF665C Overview

The FPGAs AMD Xilinx XC5VSX50T-2FF665C is a highly capable field programmable gate array designed to meet the needs of advanced digital processing systems. This product, engineered by AMD Xilinx, offers a blend of performance, flexibility, and scalability that makes it an ideal choice for developers and engineers looking to push the boundaries of technology. With its 360 I/O capabilities housed in a 665FCBGA package, the XC5VSX50T-2FF665C supports a wide range of applications, from complex digital signal processing to high-speed data communication frameworks.

XC5VSX50T-2FF665C Features

The XC5VSX50T-2FF665C FPGA is packed with features that enhance its utility and efficiency in various high-demand applications. Key features include its 665-pin flip-chip ball grid array (FCBGA) package, which ensures robust physical connections and excellent thermal management. Additionally, the 360 I/O options provide ample flexibility for interfacing with other key components in a system, allowing for comprehensive system integration and optimization.

XC5VSX50T-2FF665C Applications

  • Telecommunications: Utilized in routing and switching technology to manage and route high volumes of data efficiently across networks.
  • Automotive Systems: Embedded in driver assistance systems to process real-time sensor data and enhance vehicle safety and functionality.
  • Consumer Electronics: Forms the core of high-performance computing devices such as gaming consoles and smart TVs, providing the necessary processing power for rich multimedia experiences.
  • Industrial Automation: Used in control systems for automating complex industrial processes, improving precision and reliability.
  • Medical Devices: Integrated into imaging systems like MRI and ultrasound equipment to handle complex digital imaging computations.
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