XC5VSX50T-1FFG665CES

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Mfr.Part #
XC5VSX50T-1FFG665CES
Manufacturer
AMD Xilinx
Package / Case
665-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 665FCBGA
Stock
17,497
In Stock :
17,497

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Supplier Device Package :
665-FCBGA (27x27)
Package / Case :
665-BBGA, FCBGA
Base Part Number :
XC5VSX50T
Voltage - Supply :
0.95V~1.05V
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
52224
Max Operating Temperature :
85°C
Min Operating Temperature :
0°C
Published :
1999
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
RAM Size :
594kB
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Number of LABs/CLBs :
4080
Number of Logic Blocks (LABs) :
4080
Total RAM Bits :
4866048
Number of I/O :
360
Series :
Virtex®-5 SXT
Packaging :
Tray
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-1FFG665CES from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:665-BBGA, FCBGA, Base Part Number:XC5VSX50T, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XC5VSX50T-1FFG665CES pinout, XC5VSX50T-1FFG665CES datasheet PDF, XC5VSX50T-1FFG665CES amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-1FFG665CES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VSX50T-1FFG665CES


FPGAs AMD Xilinx XC5VSX50T-1FFG665CES Overview

The FPGAs AMD Xilinx XC5VSX50T-1FFG665CES is a highly sophisticated, field-programmable gate array designed to meet the rigorous demands of high-speed, complex digital processing. With its dense integration, the XC5VSX50T-1FFG665CES offers optimal performance for a range of high-tech applications, making it a go-to solution for engineers and designers looking to leverage advanced digital circuitry. Embedded with 360 I/Os and packaged in a compact 665FCBGA, this FPGA facilitates efficient, scalable designs and rapid prototyping in demanding environments.

XC5VSX50T-1FFG665CES Features

The XC5VSX50T-1FFG665CES by AMD Xilinx incorporates multiple key features that enhance its utility in complex electronics. This includes a high I/O count that is ideal for multi-functional systems, a compact ball grid array (BGA) package that ensures a reduced footprint on the system board, and advanced heat dissipation capabilities that promote better overall reliability and performance in prolonged operational conditions.

XC5VSX50T-1FFG665CES Applications

  • Data Centers: Utilized for managing high-speed data processing and storage operations, ensuring efficient and reliable data handling capabilities.
  • Telecommunication Infrastructure: Plays a crucial role in signal processing equipment, helping in the facilitation of enhanced communication services like high-speed internet and mobile communications.
  • Automotive: Integrated into driver assistance systems, providing the computational power necessary for real-time processing and decision making.
  • Medical Imaging: Essential in the processing units of advanced imaging devices such as MRIs and CT scanners, offering rapid data processing capabilities that aid in delivering high-resolution images.
  • Industrial Automation: Applied in control systems for manufacturing lines, improving the efficiency and precision of industrial processes.
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