XC5VSX50T-1FF665C

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Mfr.Part #
XC5VSX50T-1FF665C
Manufacturer
AMD Xilinx
Package / Case
665-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 665FCBGA
Stock
29,858
In Stock :
29,858

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Number of Terminations :
665
Number of I/O :
360
Published :
1999
Package / Case :
665-BBGA, FCBGA
Length :
27mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Radiation Hardening :
No
Base Part Number :
XC5VSX50T
Voltage - Supply :
0.95V~1.05V
Factory Lead Time :
11 Weeks
Height Seated (Max) :
2.9mm
Pin Count :
665
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
4866048
Number of Pins :
665
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Number of Outputs :
360
Series :
Virtex®-5 SXT
Terminal Finish :
Tin/Lead (Sn63Pb37)
Operating Supply Voltage :
1V
Width :
27mm
Peak Reflow Temperature (Cel) :
225
Number of LABs/CLBs :
4080
Mount :
Surface Mount
JESD-609 Code :
e0
Speed Grade :
1
Packaging :
Tray
RoHS Status :
Non-RoHS Compliant
Supply Voltage :
1V
Number of Logic Elements/Cells :
52224
Terminal Form :
Ball
Pbfree Code :
No
RAM Size :
594kB
Time@Peak Reflow Temperature-Max (s) :
30
Datasheets
XC5VSX50T-1FF665C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-1FF665C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:665, Package / Case:665-BBGA, FCBGA, Base Part Number:XC5VSX50T, Number of Pins:665, Operating Temperature:0°C~85°C TJ, XC5VSX50T-1FF665C pinout, XC5VSX50T-1FF665C datasheet PDF, XC5VSX50T-1FF665C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC5VSX50T-1FF665C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC5VSX50T-1FF665C


FPGAs AMD Xilinx XC5VSX50T-1FF665C Overview

The AMD Xilinx XC5VSX50T-1FF665C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital applications. This FPGA offers a blend of versatility, performance, and high-density integration, making it an ideal solution for developers looking to push the boundaries of technology in various industries. With its 665-pin flip-chip ball grid array (FCBGA) packaging, the XC5VSX50T-1FF665C facilitates robust physical integration and superior signal integrity, crucial for high-speed digital processing. The integration of 360 I/O ports ensures ample connectivity for complex digital systems, enhancing system design flexibility and scalability.

XC5VSX50T-1FF665C Features

  • High I/O Count: Features 360 input/output ports for comprehensive connectivity options.
  • Dense Packaging: Utilizes a 665FCBGA package, optimizing board space and enhancing performance with a smaller footprint.
  • Flexible Configuration: Offers programmable logic for tailored applications, supporting a wide range of uses from simple logic control to complex digital signal processing.
  • Advanced Technology: Built with AMD Xilinx's cutting-edge technology, ensuring reliability and high performance in demanding operational conditions.

XC5VSX50T-1FF665C Applications

  • Data Centers: Employs high-speed data processing capabilities to manage and streamline operations in large-scale data centers.
  • Telecommunications: Supports complex signal processing tasks for next-generation telecom infrastructures, enhancing bandwidth and reducing latency.
  • Automotive: Integrates into driver assistance systems to process real-time data from multiple sensors, improving vehicle safety and performance.
  • Medical Devices: Used in medical imaging systems to process large datasets quickly and efficiently, assisting in faster and more accurate diagnoses.
  • Aerospace and Defense: Provides robust and secure processing for navigation and communication systems in challenging environments.
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